Sunday, September 20, 2009

Manufacturing & Reliability Challenges with QFN: CTEA on Oct 23rd

One of the fastest growing package types in the electronics industry today is the quad flat pack no lead (QFN), also known as a bottom-termination SMT component. While the advantages of QFNs are well documented, concerns arise with manufacturability, compatibility with other OEM processes, and reliability.

I've published two articles on this topic. Part I addresses the manufacturing aspects while Part II addresses the reliability aspects.

I'll be presenting on QFN challenges next at the:

Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum

in Austin, TX on Thursday, October 23rd.

Registration to attend the event is free!

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