Wednesday, August 31, 2011

Thermal Uprating

Using a component above its rated temperature is always challenging (and surprisingly common). In this white paper, DfR provides a concise explanation of uprating, including the risks, the costs, and the process. For more component-specific guidance, visit our White Paper web page. For more information on our uprating and derating services, please contact Gregg Kittlesen,

Tuesday, August 30, 2011

True Root-Cause Analysis (RCA)

The staff at DfR Solutions performs over 400 failure investigations every year. What differentiates DfR from all the others? We know true root cause analysis. As detailed in this illustrating report, DfR surpasses other organizations by using unparalleled combination of equipment, electrical characterization, and knowledge of manufacturing methods and semiconductor physics. For more information on how we can take your organization to the next level, please contact Tom Johnston,

Saturday, August 27, 2011

Sherlock Automated Design Analysis Tool Expanding Rapidly

The response of the electronics community to DfR's new Automated Design Analysis™ tool has been overwhelming. Since the launch of Version 2.0, over one hundred licenses have been issued and demand continues to rise. TRW is just one of many satisfied customers. Interested? Contact us at and learn how you can be a part of a design revolution.

Friday, August 26, 2011

RoHS Part II Finally Arrives

The new RoHS Directive became law on July 21, 2011. Key points:
  • No new restricted substances
  • Nine (9) exclusion categories - military, space, transportation (trains, planes, autos), fixed installation, large industrial tools, off-road machinery (i.e., bulldozers), implantable devices, solar panels, and R&D equipment
  • Compliance timeline - medical and monitoring/control have 3 years, in-vitro medical has 5 years, and industrial monitoring/control has 6
  • Exemptions will end in 5-7 years, including telecom and high lead
  • CE mark required
  • Larger companies must go beyond certificates of compliance
  • Your EU importer is now also liable
  • Oh, and don't forget India
See how this differs from our reporting two years ago. What will this mean? More paperwork and more testing. Need help? Contact Craig Hillman,

Friday, August 12, 2011

Design for ESD & ESD Failure Analysis on Aug 18th at 3pm

2011 TX ESD ASSOC Event

Aug 18, 2011 at 3pm - Design for ESD and ESD Failure Analysis Techniques
3M Innovation Center

Why Design for ESD Prevention?

The foundation of a reliable product is a robust design which provides margin, mitigates risk from defects, and satisfies the customer. Ensuring reliability of electronic designs is becoming increasingly difficult due to:

• Increasing complexity of electronic circuits
• Increasing power requirements
• Introduction of new component and material technologies
• Introduction of less robust components

This results in multiple potential drivers for failure. While most companies are acutely aware of the hazards of ESD (electrostatic discharge), few are aware of just how pervasive ESD failures actually are.

Join us for this presentstion and see what you need to do or learn more about. Presentation geared for engineers and manufacturing personnel who need to learn more and understand design for ESD prevention and how it applies to their individual applications.

There is no charge for attending however we do ask you to RSVP with your name, company, phone and email for badging and planning purposes. Your information is not given outside the Texas ESD Association except to 3M security to make badges.

RSVP to Ray Bowman []

For more information regarding Texas ESD Association activities, please go to the following