Tuesday, July 26, 2011
Susy Webb - Sr. PCB Designer at Fairfield Industries
How current flows through a stack and why the stackup is SO important for the board to work properly.
This is a half day presentation squeezed into 2 hrs for our chapter meeting with lots of good information! Susy has done a lot of research and will be presenting this at the IPC Design Conference, PCB West, in September.
Presenter Bio: Susy Webb is a senior PCB designer with 32 years of experience. Her career includes experience in a variety of fields, including point-to-point microwave network systems, oceanographic oil exploration
equipment, and CPCI and ATX computer motherboards. She has set up company standards, documentation, procedures, and library conventions for several companies. Susy is a regular speaker at the PCB and IPC conferences and has made presentations internationally as well, discussing practical implementation of engineering concepts into board layout, and methods to improve the overall design and flow of printed circuit boards. She is CID certified and has been a writer/columnist for Printed Circuit Design and Fab magazine. She is an active member of the IPC Designer's Council Executive Board at the international level and a member of its education committee. She is also a past president of the Houston (Tx) Chapter of the Designer's Council. We are pleased to offer her presentation to AHOT Members!
Location: Cadence Design Systems, Inc.
RSVP to Linda at 512-259-2465,
12515-7 Research Boulevard, Ste 250
Sunday, July 24, 2011
Sunday, July 17, 2011
DFM-Design for Manufacturing
Cheryl Tulkoff, DfR Solutions
Wednesday, August 3
10:00 am–11:00 am CT
Design for manufacturability (DFM) best practices ensure that manufacturing capability is taken into consideration during the design and layout of a product. By understanding the potential effects of — and how to avoid — overtaxing their manufacturer, engineers can be confident in the execution of their design. Attendees will come away with a greater comprehension of the potential manufacturability hazards to avoid during the design process, and an understanding of the benefits of DFM.
What You Will Learn
- Printed board design and process material selection
- Equipment process controls and reliability testing
- Matching pcb complexity to supplier capabilities
- Influences of PCB thickness, cut-outs, and depanelization techniques on reliability
- M.S.L, handling, process optimization and control strategies, repair and rework
About the Instructor
Cheryl Tulkoff is a senior member of the DfR Solutions staff. Her areas of expertise include semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. Prior to joining DfR, Tulkoff developed a comprehensive reliability organization at National Instruments, including creation of an internal failure analysis group and a closed-loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication in electronics assembly at Cypress Semiconductor and IBM.