Check back after the event for a recap! Some details on the sessions and what he'll be up to:
The Reliability of ‘Green’: Going Beyond SAC305- Sunday, October 4
Randy Schueller, Ph.D., DfR Solutions
What You Will Learn
As the RoHS legislation enters its third year, knowledge of the basics of Pb-free design and manufacturing is proliferating. Consumer electronic OEMs have been manufacturing Pb-free electronics for several years while even companies that produce higher reliability products (telecom, industrial, medical, military, avionics) have made the transition or are in the process of preparing for the eventual demise of SnPb. Unfortunately, the introduction of new environmental legislation and new environmental-friendly materials continues at a rapid pace. As a result, the design / manufacturing / component / reliability engineer continues to struggle with new Pb-free alloys and halogen-free materials, among other issues. While this course will provide a comprehensive overview of some of the challenges of Pb-free, it will also focus on some of the newest issues in ‘green’ electronics. These will include tin whisker mitigations, halogen-free laminate, manufacturing challenges that continue to be a problem with Pb-free, the performance of second (2nd) generation Pb-free solders, and the newest long-term reliability information for Pb-free.
Who Should Attend
This course is geared toward engineers and managers in the areas of product development, manufacturing, quality, or reliability. Nearly all companies are migrating toward green products whether or not it is intentional. As non-green materials in the electronics industry are phased out, it is critical to understand the key differences and reliability issues that can result from the new material and processes. Consequently, anyone involved in the early life cycle of a product who wishes to mitigate the risk of failure would find value in attending this course.
Topics Covered
- Components
- Understanding process sensitivity levels (PSL)
- Tin Whisker: predictions and mitigations
- Printed Circuit Boards
- Predicting and preventing printed board damage
- Newest Pb-free solderability finishes
- Halogen-free laminates: the good, the bad, and the ugly
- Solder and Manufacturing
- 2nd generation solders: what/who/why
- Finding a solution to hole fill
- Is Pb-free the culprit to head-in-pillow?
- Long-Term Reliability
- Temperature cycling
- Mechanical shock
- Vibration
The advent of lead-free soldering with the de-facto SAC305 standard and its close relatives has resulted in poor performance and increased cost in some applications. It is only natural that research for substitute materials would transpire. This session will cover some of the work in this arena, most notably Investigations on the processability of SnCuNi alloy for SMT assembly, efforts to minimize and standardize the number of lead-free alloys used, and experimental data and its interpretation for some "second generation" lead-free alloys. The papers will present process development, reliability data, and explanation of the results. This session is ideal for the person who wants to be brought up to speed on what is happening in alternative lead-free alloys to improve performance and reduce cost.
Randy Schueller
, Ph. D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D., DfR Solutions Options for Controlling Moisture Sensitivity in Packages and PWBs During Assembly- Tuesday, October 6
Randy Schueller
, DfR Solutions New Technical Advancements in PCB Surface Finishes - Wednesday, October 7
Chair: Randy Schueller, Ph.D., DfR Solutions
The surface finish one selects for the PCB is oftentimes the most critical decision in enabling a successful assembly process, and ultimately a reliable end product. The fact that there are half a dozen widely used surface finishes currently on the market suggests there is no single one that meets the many needs of the industry and thus sacrifices are being made. Much research and development is taking place to significantly improve existing surface finishes and in some cases invent new finishes with attributes suitable for a wider range of products. This session contains three excellent papers; the first addresses the important issue of controlling creep corrosion failure on immersion silver PCBs. The new use of organic metals to greatly improve the characteristics of immersion tin finishes is presented in the second paper. The final paper is the revealing of a promising new surface finish material with many attractive properties for the electronics industry. Anyone involved in design, assembly, or reliability would benefit from this session.
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