Sunday, April 29, 2012

IEEE Central Texas Section 2012 International Conference on IC Design and Technology

ICICDT2012 Conference EARLY REGISTRATION ENDS April 30th, 2012

ICICDT2012 conference will be held at Freescale in Austin, TX from May 30th – June 1st 2012.  

On the first day of ICICDT, four cutting-edge tutorials from industry leaders allow attendees to gain an in-depth understanding of critical issues in technology, circuit, and architecture design.  Variability in device and circuit parameters adversely affects the performance, energy efficiency, and reliability of integrated circuit products across all market segments, ranging from large multi-core servers to small embedded designs in a system-on-chip (SoC).  Aligned with the goal of ICICDT, the tutorial program focuses on the interaction between the technology, circuit, and architecture levels to enable robust and variation-tolerant systems.

The tutorial program opens with a presentation on advanced transistor technology by Dr. Andy Wei of GLOBALFOUNDRIES.  This tutorial describes the recent advancements of non-planar multi-gate transistors to enhance electrostatics while reducing variations to enable future device scaling.  In particular, this presentation highlights the key challenges and design tradeoffs for performance, power, and SoC integration.  The second tutorial by Dr. Vijay Reddy of Texas Instruments focuses on transistor aging from bias temperature instability (BTI).  This presentation reviews the basic transistor reliability physics and evaluates the impact of transistor aging on circuits and SoC products.  The third tutorial by Prof. Chris Kim of the University of Minnesota presents circuit-level design techniques to mitigate the impact of transistor aging on circuit performance and power.  These techniques include on-chip reliability monitors, memory yield enhancement circuits, and advances in CAD.  The tutorial program concludes with a presentation on hardware and software co-design for variation-tolerant systems by Prof. Vijay Janapa Reddi of the University of Texas.  This presentation provides a system-level perspective of the opportunities from hardware and software interactions to enhance performance and energy efficiency while maintaining historically high reliability standards at low costs.

Please go to this link for the full conference program and registration information.

Monday, April 23, 2012

DfR Solutions' Cheryl Tulkoff in Germany May 7-11

Cheryl Tulkoff will be visiting companies in Germany and is available to discuss DfM, root-cause analysis, and product qualification testing. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

Thursday, April 19, 2012

DfR Solutions at Avionics Maintenance Conference in Anchorage, AK: April 30-May3

Walt Tomczykowski and Craig Hillman will be attending this critical industry conference and presenting case studies on how DfR's Sherlock software could have been used to avoid or mitigate many of the issues identified and discussed by the conference attendees.

Tuesday, April 17, 2012

SMT Hybrid Packaging 2012 Conference - Nuremberg, Germany May 8 - May 10

I'll be attending and teaching at SMT Hybrid Packaging 2012 in Nuremberg, Germany May 8-May 10.

On Thursday, May 10th, I'll teach Tutorial 16 on:

Design for Reliability and Sourcing of Printed Circuit Boards


Thursday, 10.05.2012, 09:00 - 12:00 hrs


Cheryl Tulkoff, DfR Solutions, College Park, USA




In the electronics industry, the quality and reliability of any product is highly dependent upon the capability of the manufacturing supplier, regardless of whether it is a contractor or a captured shop. Manufacturing issues are one of the top reasons that companies fail to meet warranty expectations, which can result in severe financial pain and eventual loss of market share. What a surprising number of engineers and managers fail to realize is that focusing on processes addresses only part of the issue. Design plays a critical role in the success or failure of manufacturing and assembly. Designing printed boards today is more difficult than ever before because of the increased lead free process temperature requirements and associated changes required in manufacturing. Not only has the density of the electronic assembly increased, but many changes are taking place throughout the entire supply chain regarding the use of hazardous materials and the requirements for recycling. Much of the change is due to the European Union (EU) Directives regarding these issues. The RoHS and REACH directives have caused many suppliers to the industry to rethink their materials and processes. Thus, everyone designing or producing electronics has been or will be affected.

Target group: Managers & Engineers representing the PCB Design, Manufacturing, Process Planning and Development and Failure Analysis functions.

To learn more about the conference, click here.

To register, click here.

For the conference flyer, click here.

Monday, April 9, 2012

DfR Solutions seeks a Reliability Analyst/Engineer in the Washington, DC Metro Area

Reliability Analyst / Engineer
Full-time onsite at customer location in Washington, DC, metro area.


  • DoD 5000 acquisition directives and regulations
  • DoD major weapons systems development timeline with an emphasis on reliability and maintainability activities
  • Reliability design principles and practices including part selection, physics of failure, R&M math models, etc.
  • Best practices in test development and execution including HALT/HASS, reliability growth tests, accelerated life testing, etc.

Required Experience/Education:

  • Minimum 10 years of experience including direct experience with system-level technical reviews
  • Minimum B.S. degree in engineering
  • Secret clearance and US citizenship


  • Cross-domain experience (air, land, sea, space) a plus
  • Certified Reliability Engineer (CRE)
  • Green Belt Six Sigma
Qualified individuals should e-mail their resume along with a cover letter

Sunday, April 8, 2012

DfR Solutions seeks a Reliability Manager in DC Metro Area

Reliability Manager
Full-time onsite at customer location in Washington, DC, metro area.

Individual will utilize a thorough knowledge of the DoD 5000 acquisition process to draft policy and guidance documents and to review DoD major weapons systems reliability and maintainability documentation. Individual will supervise a team of reliability engineers and analysts. This is a fast-paced, high-visibility position that requires the applicant to be highly engaged, capable of managing multiple tasks, writing comprehensive reports and meeting critical deadlines. Position includes travel up to 25% of the time.


  • Highly skilled in presenting to senior leadership in both industry and government
  • Thorough knowledge of reliability improvement, growth theory and practice, and the DoD 5000 acquisition process to include the Defense Acquisition Guide
  • 20 years experience working in the DoD system program office
  • Minimum M.S. degree in engineering
  • Secret clearance and US citizenship


  • Cross-domain experience (air, land, sea, space) is a plus
Qualified individuals should e-mail their resume along with a cover letter.

Friday, April 6, 2012

DfR's Walt Tomczykowski gives a webtorial on Sherlock & Planned Maintenance on April 19, Noon EDT

Walt Tomczykowski will be conducting a webtorial entitled "What Can Sherlock Do For You-Planned Maintenance? For more information on this informative event please contact Walt Tomczykowski.