DfR has documented a comprehensive review methodology for a Product Delivery Process (PDP) that involves the entire product life cycle from design to manufacturing to delivery. The approach utilizes well established "Benchmarking," "Organizational Re-Engineering" and "Lean Process" evaluation methods. The intent is to identify the various steps in a company's current PDP and to benchmark their effectiveness and efficiency to best-in-class organizations. For more information on how DfR can help your organization become a market leader, contact Cheryl Tulkoff, firstname.lastname@example.org.
Monday, February 28, 2011
Friday, February 25, 2011
Craig Hillman will be visiting companies in the Dayton, OH area in early March. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell,email@example.com.
Thursday, February 24, 2011
In collaboration with iMAPS, DfR Solutions will present a broad-based webinar on the challenges of designing for an environment with changing temperature. Whether your product is military, industrial, or part of the 'Free Air Cooling' trend, this insightful presentation will identify all of the mechanisms affiliated with thermal cycling and how to rapidly assess these risks during product design. To register, please contact Brian Schieman, firstname.lastname@example.org. For more information, contact Nathan Blattau, email@example.com.
Wednesday, February 23, 2011
Fans continue to be a liability in the long-term reliability of electronic systems. To address this risk, DfR has developed an accelerated test methodology that is a singular solution for electronic OEMs attempting to select fan suppliers or attempting to determine the root-cause of field failures. By subjecting fans to conditions more applicable to application environment, their true capability and performance can be assessed in a fraction of the time. For more information, contact Tom Johnston.
Tuesday, February 22, 2011
The electronics industry has struggled to find the right combination of confidence and cost in mitigating the risk of tin whiskers. An excessive reliance on environmental testing has resolved neither of these issues. The real solution, detailed in this white paper, relies on the fundamentals of physics and quality control to put a stop to whiskers once and for all. For more information, contact Randy Schueller.
Monday, February 21, 2011
After years of development and a successful launch among early adopters, DfR Solutions is launching version 2.0 of its revolutionary electronic design analysis software. This unrivaled product provides the most comprehensive solution available for Physics of Failure (PoF) based analysis of electronic designs. The software's intuitive commands and ease of use invite usage among a broad range of engineers and managers, where rapid results provide almost immediate feedback on product designs and their performance in the hands of the customer.
Friday, February 18, 2011
Craig Hillman and Jim McLeish will be visiting companies in the Michigan area February 23rd through the 25th. If you and your colleagues would be interested in a visit and possibly a presentation on a range of technical topics, please contact June Caswell.
Thursday, February 17, 2011
Craig Hillman and Ed Wyrwas will be presenting "Physics of Failure Approach to Integrated Circuit Reliability" at the G12 Solid State Devices Committee Meeting on Thursday, February 17th. For more information, or to arrange to meet with them, please contact Ed Wyrwas.
Wednesday, February 16, 2011
Tuesday, February 15, 2011
Dr. Kittlesen is internationally recognized as an expert in the fields of optoelectronic device and integrated module reliability engineering. Prior to joining DfR Solutions, he was responsible for component and module reliability evaluation at Ciena Corporation, a leading supplier of network infrastructure solutions. His experience included qualification programs, supplier audits, corrective action resolution, failure analysis, reliability prediction, and prognostic health management. Previous positions at Ericsson Microelectronics and Analog Devices included wafer-level testing and qualification of integrated laser/modulator (DFB/EA) devices, chip product engineering, RF bipolar process integration and qualification, etch/deposition tool evaluation and process development.