Tuesday, January 31, 2012

DfR at PERM Meeting in Arlington, VA: February 2

Craig Hillman and Joelle Arnold will be making a presentation on the status of DfR's two SBIR programs addressing the reliability of reballed BGAs and the reliability of various Pb-free component packages when subjected to shock and vibration testing. For more information contact Joelle Arnold.

Monday, January 30, 2012

Record Attendance at DfR's "Modeling and Simulation in Electronic Packaging" Course

A packed audience at the 2011 Electronic Packaging and Technologies Conference listened to Craig Hillman provide a comprehensive understanding on how to model and simulate the reliability of the latest semiconductor packaging technologies, including copper wire bonds, through silicon vias (TSV), package on package (PoP), and low glass transition temperature (Tg) underfill. For more information on how DfR is driving modeling and simulation (M&S) to the common engineer, please contact Nathan Blattau.

Sunday, January 29, 2012

Walt Tomczykowski Re-Elected Vice Chair of GIDEP Industry Advisory Group

DfR is proud to announce Walt's continued participation of this important industrial organization. Walt's leadership and insight has become critical as industry and government respond to recent Counterfeit Parts Legislation. As stated by Jim Stein, GIDEP Program Manager, "Walt's breadth and depth of knowledge in the subjects of DMSMS and non-conforming materiel results in his perspectives carrying a lot of weight." For more information on DfR's counterfeit activities, please contact Walt.

Friday, January 27, 2012

DfR and ISD Italia Partner on Sherlock

DfR is proud to announce that ISD Italia, a leading supplier of software solutions for the electronics industry, will be supporting Sherlock sales and services in Southern Europe and Mediterranean region. For more information, please contact Stefano Barbati.

Wednesday, January 25, 2012

Application-Specific Integrated Circuits (ASICs) - The Secret to Good Design (Part 2)

The ASIC design flow is a complex process with many important details. First-pass success is desired, but it requires a few iterations to get the information needed to fully meet specifications. DfR can provide support and guidance to help you navigate this process, which is delineated in this white paper. For more information, contact Francisco Tejada.

Tuesday, January 24, 2012

DfR Solutions asked to give keynote at DSO National Laboratories Reliability Seminar

Craig Hillman was recently invited to give the keynote address at the 2011 Reliability Technical Seminar at Singapore's DSO National Laboratories. In his presentation on "Understanding Commercial Best Practices for Ensuring Quality, Reliability, and Durability," Dr. Hillman detailed how leaders in the commercial electronics marketplace have developed effective and methodical processes for ensuring product by laying a foundation of knowledge, early engagement, quality control, and trust-but-verify techniques. For a copy of the presentation, please contact Ed Dodd.

Sunday, January 22, 2012

REACH Moves Forward

The European Chemicals Agency (ECHA) has added twenty (20) more materials to the Candidate List of Substances of Very High Concern (SVHC). While none of the materials tend to be present in electronics, companies must stay abreast of these changes and be aware of their legal obligations. For more information or guidance, please contact Craig Hillman.

Friday, January 20, 2012

Cleanliness - the DfR Way

Way overdue, IPC-5704 requires the use of ion chromatography (IC) to identify the amount and type of contamination present in printed boards. The document also sets a limit for each contaminant, providing clear pass/fail criterion. It is good to see an industry standard in line with best practices championed by DfR Solutions. DfR performs IC testing routinely for our customers and can help you assure the cleanliness of your electronics. For more information, contact Seth Binfield.

Thursday, January 19, 2012

DfR's Survey of the Month: Conformal Coating

As a service to our valuable readers, DfR has launched our Survey of the Month. Its purpose is to help you gain deeper insight into the latest and greatest within the electronics industry. By participating, you receive a free summary of the survey results. This Survey of the Month focuses on conformal coatings.

Wednesday, January 18, 2012

DfR Solutions Presenting at RAMS 2012 Conference in Reno, NV: Jan 23-26

Walt Tomczykowski will be presenting a tutorial "Introduction to Physics of Failure: Delivering Reliable Products" at the RAMS 2012 Conference in Reno, Nevada. In addition, Walt and Ed Dodd will be manning the DfR booth in the exhibit area. Be sure to stop by and visit with them. For more information contact Walt Tomczykowski.

Thursday, January 12, 2012

February 7th IPC AHOT Designers Council Meeting

Upcoming Chapter Meeting on February 7, 2012, 6 P.M.

"Architecting the PCB", Presented by Wayne Pulliam

Successful construction of any complex structure requires planning. The more detailed the planning the better chance the final product will be as expected. Join me in discussing the process of planning a PCB.

Speaker Bio

Wayne Pulliam has been at Advanced Micro Devices for 15 years. In his position as PCB Interconnect Architect, he "floor plans" printed circuit boards for future microprocessor products and advises on current printed circuit board designs. Wayne also controls the pin-outs on all microprocessors and related product to ensure that they are design friendly and cost effective. A PCB designer for 21 years Wayne's background also includes drafting and electrical experience. Several years as an electronics repair technician and several more doing sheet metal case design before entering the field of printed circuit board design. Wayne is a member of the PCB Designer Conference Top Gun Hall of Fame.

Pizza and drinks will be provided: RSVP to Linda at 512-259-2465, or email <mailto:linda@kutzsales.com>

Location: Cadence Design Systems, Inc.

12515-7 Research Boulevard, Ste 250

Austin, Texas 78759


Tuesday, January 10, 2012

DfR Solutions at 2012 SMTA Houston Expo

Please join us for our 2012 Houston SMTA Expo & Tech Forum at the Stafford Centre, 10505 Cash Road, Stafford, Texas 77477. Come see what the industry has to offer in new products and services with over 60 tabletop exhibitors. The Expo will be held in Ballroom A through C and the Tech Forum will be held in Room 104 and 105. Free lunch catered by the Black Eyed Pea.

We are pleased to offer an outstanding technical program this year:

11 AM Flex Circuit Design for Reliability

Speaker: Steve Kelly, PFC Flexible Circuits Limited

Abstract: The design of flexible circuits presents a challenge to those who are primarily familiar with rigid boards. This presentation discusses the construction of six basic types of flex and rigid flex circuits and the properties of the materials that they are made from. Flex circuits have special layout rules due to the fact that they will be bent in the application, and because the material properties create unique challenges in assembly. The major differences between flex and rigid board layouts will be discussed, as well as a short primer on design for impedance control in flex circuits.

Speaker: Steve Kelly is the President and founder of PFC Flexible Circuits Limited in Toronto, Ontario. He has been involved in the design and manufacture of flex and rigid flex circuits for 28 years. Steve holds a Bachelor’s degree from McMaster University and an MBA from the University of Western Ontario.

Abstract: A long-time need for high temperature solders has existed in many industries including industrial controls, aerospace, and oil exploration. Basic material requirements have typically been ease of assembly, resistance to creep, low cost, and more recently Pb-free. Now may be the perfect time to rethink some of these past approaches. This presentation will review traditional approaches and some variations, then expand into some of the many alternative methodologies that are in recent use as well as those under development or being evaluated.

Speaker: Cheryl Tulkoff is an industry renowned expert in the fields of semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. At her most recent position at National Instruments, Cheryl developed a comprehensive reliability organization, including the creation of an internal failure analysis group and a closed loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication through her work at Cypress Semiconductor in electronics assembly, and through her work at IBM. Cheryl is the head of DfR’s newest office located in Austin, Texas, which opened in February 2009.

Abstract: Over the past few years, the test philosophy has changed from ICT (in-circuit testing) to flying probe testing due to the cost of fixturing and required engineering resources. This presentation will review the history of automated test systems, how far technology has advanced the capabilities of flying probe testing and how to develop a test strategy to ensure best overall test coverage and throughput.

Speaker: John Oaf is Applications Manager for the Takaya Group at Texmac, Inc. He has over 24 years experience in production testing at GenRad, Inc. and Teradyne, Inc.


2012 Show Schedule

10 a.m. Expo open to attendees

11:00 a.m.-11:45 a.m. Technical Presentation

Topic: Flex Circuit Design for Reliability

Speaker: Steve Kelly, PFC Flexible Circuits

11:45 a.m. Door prize drawing

12:15 p.m. - 12:45 p.m. – Free Lunch

12:45 p.m. - 1:00 p.m. - Random Drawings for Gift Certificates and Special Mid-Day Prize

(must be present to win)

1:00 p.m. - 1:45 p.m. Technical Presentation

Topic : Advances & Challenges in High Temperature Component Attachment

Speaker: Cheryl Tulkoff, DfR Solutions, LLC

1:45 p.m. Door prize drawing

2:00pm-2:45pm Technical Presentation

Topic: How Flying Probers Optimize Test Strategy

Speaker: John Oaf, TEXMAC Inc.

2:45 p.m. Door prize drawing

3:00 p.m. - 3:15 p.m. - Random Drawings for Gift Certificates and Special Afternoon Prize (must be present to win) 3:15 p.m. - 3:30 p.m. - Drawings for Bingo Prize (need not be present to win)

Drawing for Free Booth for 2013 (exhibitors only) 3:00 p.m. - 5:00 p.m. - Networking Reception - Beverages and Snacks - no charge

We look forward to seeing you at the Expo on February 9! Please register on-line or call the SMTA at (952)920-7682. For exhibitors, we have extended the early-bird rate until January 31.

Monday, January 9, 2012

Free Texas ESDA Event: Future Trends Presentation "Clouds in the Forecast?

"Future Trends Presentation "Clouds in the Forecast?"
3M Innovation Center
Austin, TX
Tuesday, Jan 24, 2012 (3-5 PM)
Our next Texas ESD Association meeting is on future trends in electronics. A wide variety of factors drives electronic equipment sales, which drives semiconductor designs (and a little vice versa). So it's important to understand what products are hot, what features are attractive, where influences are coming from, and what seems like will never make it. On the heels of the Consumer Electronics Show and the turn of a new year, this will be an interactive presentation, discussing trends that are emerging in technologies, markets that show promise and companies that are riding the waves.
Tom Starnes analyzes the products, technologies, companies, applications, markets, and business strategies of the embedded processor industry. Before joining market research firm Objective Analysis and consulting at Strategy Sanity, he built a reputation for keen insight while an analyst at Gartner Dataquest. His technical and business credentials come from marketing processors at Motorola (now Freescale) after earning a BSEE from the University of Texas.

RSVP - no charge for attending however for this meeting we do require you to reply to this email and RSVP with your name, company, phone and email for planning purposes. Your information is not given outside the Texas ESD Association except 3M security for badging purposes.