|Craig Hillman and Ed Wyrwas will be presenting DfR's Silicon-to-Systems solution for predicting reliability at the Microelectronics Reliability and Qualification Workshop on December 13th. For registration information, please contact Ronald Lacoe, email@example.com.|
Wednesday, November 30, 2011
Monday, November 28, 2011
CAM / CAE Engineer
A rapidly growing high technology software and consulting company is looking for mechanical engineer with experience with Abaqus finite element method (FEM) software.
The position has two primary responsibilities. The first responsibility is performing FEM simulations for Fortune 500 companies. The focus of the FEM simulations will primarily be on electronics and microelectronics packaging. Examples include vibration of circuit cards, temperature cycling of chip scale packages, and bending of fiber optic channels. These consultations may also periodically involve testing to validate FEM predictions.
The second responsibility is to provide support to customers of Sherlock Automated Design Analysis™ software. The tool performs physics-based reliability predictions and design rule checks for the electronics industry. Some of the analysis involves an embedded FEM engine. A successful applicant will be thoroughly trained on the architecture and capabilities with the software and will be expected to train customers, answer questions, and perform analyses using the software. A minor amount of travel (once or twice a quarter) may eventually be required as part of this position.
The ideal candidate will thoroughly enjoy problem-solving and have the ability to communicate findings, both verbally and in writing, to customers. A Masters’ Degree in Mechanical Engineering is highly preferred, but work experience may be an acceptable substitute. Applicants must also be comfortable working as part of a team with people from a variety of technical backgrounds. An availability to start immediately is preferred.
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain). For more information regarding DfR Solutions, visit www.dfrsolutions.com.
Wednesday, November 23, 2011
As parts get smaller and smaller and the pitch between contacts gets closer and closer, assuring reliability during manufacturing becomes more and more difficult.
To successfully move to 0.3mm pitch requires buy-in from the entire manufacturing industry, from the printed board manufacturer, to the solder paste supplier, to the stencil manufacturer, and a comprehensive understanding of the potential reliability risks that the change in interconnect design may entail.
Attend this informative webinar presented jointly by ITM Consulting and DfR Solutions, a leading provider of quality, reliability, and durability research and services for the electronics industry, and learn about this issue from the perspective of the manufacturing and reliability.
Don't miss out! Early Bird Registration here.
To learn more about DfR Solutions, click here.
Monday, November 21, 2011
Thursday, November 17, 2011
Wednesday, November 16, 2011
Tuesday, November 15, 2011
Monday, November 14, 2011
Friday, November 11, 2011
|Craig Hillman will be visiting customers in various parts of Germany, including Munich, Frankfurt, and Berlin. If you would like to schedule a visit to your company while he is in your area, please contact June Caswell, firstname.lastname@example.org.|
Thursday, November 10, 2011
TechSearch International –Fraunhofer Institute-Advanced Packaging Trends for Medical Electronics Workshop: Munich, Germany: November 14
|Craig Hillman will be making a presentation entitled "Dealing with New RoHS Regulations in Medical Devices: An Update" at this workshop preceding Productronica. If you would like to meet with Craig while he is in the area please contact June Caswell, email@example.com.|