Wednesday, November 30, 2011

DfR at Microelectronics Reliability and Qualification Workshop in El Segundo, CA: December 13

Craig Hillman and Ed Wyrwas will be presenting DfR's Silicon-to-Systems solution for predicting reliability at the Microelectronics Reliability and Qualification Workshop on December 13th. For registration information, please contact Ronald Lacoe,

Monday, November 28, 2011

DfR Solutions Has An Opening for CAM / CAE Engineer

CAM / CAE Engineer

A rapidly growing high technology software and consulting company is looking for mechanical engineer with experience with Abaqus finite element method (FEM) software.

The position has two primary responsibilities. The first responsibility is performing FEM simulations for Fortune 500 companies. The focus of the FEM simulations will primarily be on electronics and microelectronics packaging. Examples include vibration of circuit cards, temperature cycling of chip scale packages, and bending of fiber optic channels. These consultations may also periodically involve testing to validate FEM predictions.

The second responsibility is to provide support to customers of Sherlock Automated Design Analysis software. The tool performs physics-based reliability predictions and design rule checks for the electronics industry. Some of the analysis involves an embedded FEM engine. A successful applicant will be thoroughly trained on the architecture and capabilities with the software and will be expected to train customers, answer questions, and perform analyses using the software. A minor amount of travel (once or twice a quarter) may eventually be required as part of this position.

The ideal candidate will thoroughly enjoy problem-solving and have the ability to communicate findings, both verbally and in writing, to customers. A Masters’ Degree in Mechanical Engineering is highly preferred, but work experience may be an acceptable substitute. Applicants must also be comfortable working as part of a team with people from a variety of technical backgrounds. An availability to start immediately is preferred.

About DfR

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain). For more information regarding DfR Solutions, visit

Wednesday, November 23, 2011

Manufacturability and Reliability of 0.3mm Pitch Chip Scale Packages

SAVE THE DATE: Tuesday, December 6, 2011, 11am EDT

As parts get smaller and smaller and the pitch between contacts gets closer and closer, assuring reliability during manufacturing becomes more and more difficult.

To successfully move to 0.3mm pitch requires buy-in from the entire manufacturing industry, from the printed board manufacturer, to the solder paste supplier, to the stencil manufacturer, and a comprehensive understanding of the potential reliability risks that the change in interconnect design may entail.

Attend this informative webinar presented jointly by ITM Consulting and DfR Solutions, a leading provider of quality, reliability, and durability research and services for the electronics industry, and learn about this issue from the perspective of the manufacturing and reliability.

Don't miss out! Early Bird Registration here.

To learn more about DfR Solutions, click here.

Monday, November 21, 2011

Electronics Packaging Technology Conference in Singapore: December 7

DfR Solutions will be teaching a NEW full-day course titled "Reliability Predictions for Packaging and Tools for Analyzing Risks and Grading Packages at Board Level" at the Electronics Packaging Technology Conference. The course will be in two parts with the first addressing semiconductor packaging and the second board level reliability. For more information please contact Craig Hillman,

Thursday, November 17, 2011

Read All About DfR Solutions!

ECN Magazine published Nathan Blattau's article, "Achieving Product Reliability with Automated Design Analysis Software" in their September edition, and Touch Panel Newsletter recently published Craig Hillman's article "Capturing the Robustness of Glass Panels in Touch Screen Displays." Be sure to check out both articles. For more information contact Nathan Blattau,

Wednesday, November 16, 2011

DfR in Israel: December 4-8

Cheryl Tulkoff will be presenting a two day course for ILTAM addressing topics such as Advanced packaging Technologies, Supplier Qualification, Developing a Test Plan, Pb-free, and Design for Manufacturability. She will also be visiting customers in Israel. If you would like to arrange a visit, please contact June Caswell,

Tuesday, November 15, 2011

New Technologies in Electronic Packaging: Munich, Germany: November 17

Craig Hillman will be presenting a half day course addressing topics such as Copper Wire Bonds, Through Silicon Via (TSV), Copper Pillar, Stacked Die, and Bottom Terminated Components (BTC). He will also be visiting customers in Germany. If you would like to arrange a visit, please contact June Caswell,

Monday, November 14, 2011

Shock Webtorial in Conjunction with Qualmark: Thursday, November 17)

Dr. Nathan Blattau, DfR's Chief Technologist, will be the featured presenter for a special 2-part edition of Qualmark's popular Ask the Experts webinar series this fall. Mark your calendars to attend the October 20th session on Vibration and the November 17th session on Shock when Dr. Blattau will discuss the effects of these stresses and how they can be effectively applied during product development and process verification to deliver a more reliable product. Registration is now open.

Friday, November 11, 2011

DfR's Craig Hillman in Germany November 14-18

Craig Hillman will be visiting customers in various parts of Germany, including Munich, Frankfurt, and Berlin. If you would like to schedule a visit to your company while he is in your area, please contact June Caswell,

Thursday, November 10, 2011

TechSearch International –Fraunhofer Institute-Advanced Packaging Trends for Medical Electronics Workshop: Munich, Germany: November 14

Craig Hillman will be making a presentation entitled "Dealing with New RoHS Regulations in Medical Devices: An Update" at this workshop preceding Productronica. If you would like to meet with Craig while he is in the area please contact June Caswell,

Wednesday, November 9, 2011

Sherlock Wins 2011 PCD&F New Product Innovation (NPI) Award

On the market for only six (6) months and Sherlock has already been recognized for its innovative and unmatched capabilities by one of the most prestigious publications in the electronics marketplace, PCD&F Magazine. DfR is proud to be one of the few companies to have ever received this award and is looking forward to continuing to increase Sherlock's rapidly expanding user base. For more information on Sherlock, contact Tom O'Connor,

Tuesday, November 8, 2011


India recently published their e-waste (Management and Handling ) Rules, 2011. The rules cover both restrictions (RoHS) and disposal (WEEE). The materials, limits, and exemptions are the same as EU RoHS, but encompass a more limited scope and exemption expiration dates are not included. For more information, contact Craig Hillman

Monday, November 7, 2011

Medical Electronics and RoHS

Cheryl Tulkoff and Randy Schueller's article on "Developing a Reliability Test Plan for Lead Free Medical Electronics" was highlighted on the front cover of the November/December issue of Medical Electronics Design Magazine. For more information contact Cheryl Tulkoff,

Friday, November 4, 2011

The FAA and Pb-Free

The FAA has issued a nuanced memo that defines their position on Pb-free. They recommend familiarity with GEIA documents, a focus on five critical areas (solder joint reliability, tin whisker, repair, configuration, and obsolescence), and state that no avionic failures have been traced back to Pb-free finishes. Looking for assistance with tin whisker mitigation or lead free control plans (LFCP)? Contact Randy Schueller,, for more information.

Thursday, November 3, 2011

Latest in Pb-Free: iNEMI/IPC Solder Testing

The electronics industry is developing a standardized methodology for capturing new solder materials (manufacturability and reliability). An array of tests, including solderability, thermal cycling, mechanical shock, and pin-pull testing, are proposed. DfR Solutions is the only organization that has been involved in this document AND can perform all these activities. Need help with a new Pb-free alloy? Contact Joelle Arnold,, for assistance.