Sunday, October 24, 2010

BGA Reballing - A High Reliability Necessity

The military and high reliability market segment have maintained a higher level of stability over the past couple of years. Military manufacturers are, for the most part, still using Sn/Pb materials. The commercial industry has used Pb-free for several years and the medical industry will be following in the next couple of years. Military suppliers are using approaches such as reballing of BGAs with Sn/Pb to utilize them. DfR has extensive experience regarding the reliability of the reballing of BGA packages. Joelle Arnold,, recently presented a joint paper with Stephan Meschter of BAE at the IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications.

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