|Webinar: Thursday, October 11, 2012|
Conductive Anodic Filament (CAF) formation is a well-known mechanism involving migration of copper filaments within a printed circuit board under an applied bias. When the copper filaments bridge adjacent conductors, such as plated through holes (PTHs), they can cause loss of resistance, an electrical short, and even spectacular fireworks (if you are lucky). While CAF is influenced by a number of parameters, one of the most effective deterrents to this mechanism is good design.
In this insightful webinar, presented by DfR Solutions you will learn:
|The drivers for CAF|
|Industry best practices in preventing CAF (including CAF qualification)|
|How Automated Design Analysis of PCB design is critical to successful CAF avoidance|