Thursday, October 25, 2012

DfR's Craig Hillman presents at the IPC Medical Sector Conference in Andover, MA November 6-8

At this ground-breaking conference, Craig Hillman will speak on the "Upcoming Challenges of RoHS and Medical Devices." For more information, please contact Craig Hillman.

Gain working knowledge that you need for implementation of lead-free electronics manufacturing processes.
  • Learn about engineering challenges associated with materials selection, reliability, testing and supply chain quality control, as well as potential solutions.
  • Take home practical applications that you can use today, from technical experts who will share lessons learned from the leaded-to-lead-free conversion process at their own operations, and those of their suppliers.
  • Connect with colleagues who can help you work effectively and efficiently.
The July 2014 deadline for regulatory compliance applies only in Europe at this time, but it is a wake-up call for all organizations with global sourcing and distribution in the medical sector.
Workshop 9:00 am–3:30 pm
Challenges of Conversion: From Leaded to Lead-Free Operation
Leo Lambert, Vice President, EPTAC Corporation and Umut Tosun, CTO, ZESTRON America
Be prepared for the challenges of converting to lead free from a leaded operation.
Process awareness issues based upon the conversion will be covered, including specification changes implemented with new alloy introduction and differences in the metallurgy.

What You Will Learn
  • Process changes for implementation
  • Laminate and material changes involved in the conversion
  • Thermal profile differences
  • Lessons learned since introduction of lead-free materials in the industry
  • Criticality of cleaning
Your Instructors
With more than 30 years of experience and special expertise in metallurgy and soldering, Leo Lambert provides expert consultation developing, troubleshooting and auditing manufacturing processes. He is a Master IPC Trainer for one of the most widely-utilized industry training programs (IPC-A-600 for Acceptability of Printed Boards).

Umut Tosun is the application technology manager at ZESTRON America, and has published in leading electronics manufacturing publications and presented technical papers and studies at international conferences. He holds a Bachelor of Science degree and master’s degree in chemical engineering from the Technical University of Hamburg, Germany.
TOUR 3:30 pm–5:00 pm
Customer Visit Center at the Philips Healthcare offices
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Welcome and Introductions
Po Tse, Ph.D., Candidate, Sr. Reliability Risk Manager, Philips Healthcare
8:15 am Keynote: Reliability Priorities for Lead Free
Peter van der Heide, Ph.D., Sr. Director of Product Creation Process, Philips Healthcare
9:00 am Supply Chain: Lead-Free Quality Concerns and Expectations
Ravi Nabar, Ph.D., Sr. Director of Supplier Quality, Philips Healthcare
9:45 am PERM (Pb-free Electronics Risk Management) Status Report
Anthony Rafanelli, Ph.D., P.E., Engineering Fellow, Raytheon
10:30 am BREAK
10:45 am Past, Present and Future Lead-Free Projects Within HDPUG
Marshall Andrews, Executive Director, HDPUG (High Density Packaging User Group)
11:30 am Roles and Responsibilities Within Medical Electronics Manufacturing Organizations Mulugeta Abtew, Senior Manager, Sanmina-SCI
12:15 pm LUNCHEON
1:15 pm Lead-Free PCB Testing: Experiences in the Medical Sector
Raj Kumar, Vice President of PCB Technology, Viasystems
2:00 pm  Simulation-Based Reliability Assessment of RoHS compliant Electronic Equipment
Michael Osterman, Ph.D., Research Associate, CALCE, University of Maryland
2:45 pm BREAK
3:00 pm   Sherlock II Prediction Model for Reliability
Craig Hillman, Ph.D., CEO and Managing Partner, DfR Solutions
3:45 pm Lead-Free PCB Cleanliness Requirements
Mike Bixenman, DBA, CTO, Kyzen Corporation
4:45 pm Concluding Remarks
5:00–6:30 pm NETWORKING RECEPTION at the Wyndham Hotel
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Keynote: Benefit, Risk, and the FDA
Elisabeth George, Vice President Global Regulations & Standards, Philips Healthcare
8:45 am RoHS and Related Environmental Legislation Issues in the Context of Implantable Medical Electronics
Peter Tortorici, Ph.D., New Product Development Manager, Medtronic
9:15 am BREAK
10:30 am Optimal Choices for Lead-Free Soldering Materials
Karl Seelig, Vice President-Technology, AIM Solder
11:00 am Tin Whiskers: Detection, Formation, Mitigation
Bob Landman, President and CTO, H&L Instruments
11:45 am Concluding Remarks
12:00 pm ADJOURN
Special Contributors
  • Dr Aidan Turnbull, Principal Head of WEEE, RoHS & EcoDesign, ENVIRON International, Guide to the RoHS2 EN 50581 Standard
  • Bruce Kline, Technology Licensing Manager, Mayo Clinic
  • Riccardo Corridori, Environmental Affairs Manager, COCIR
  • Mark Kohorst, MITA/NEMA, National Electrical Manufacturers Association

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