Tuesday, April 17, 2012

SMT Hybrid Packaging 2012 Conference - Nuremberg, Germany May 8 - May 10

I'll be attending and teaching at SMT Hybrid Packaging 2012 in Nuremberg, Germany May 8-May 10.

On Thursday, May 10th, I'll teach Tutorial 16 on:

Design for Reliability and Sourcing of Printed Circuit Boards


Thursday, 10.05.2012, 09:00 - 12:00 hrs


Cheryl Tulkoff, DfR Solutions, College Park, USA




In the electronics industry, the quality and reliability of any product is highly dependent upon the capability of the manufacturing supplier, regardless of whether it is a contractor or a captured shop. Manufacturing issues are one of the top reasons that companies fail to meet warranty expectations, which can result in severe financial pain and eventual loss of market share. What a surprising number of engineers and managers fail to realize is that focusing on processes addresses only part of the issue. Design plays a critical role in the success or failure of manufacturing and assembly. Designing printed boards today is more difficult than ever before because of the increased lead free process temperature requirements and associated changes required in manufacturing. Not only has the density of the electronic assembly increased, but many changes are taking place throughout the entire supply chain regarding the use of hazardous materials and the requirements for recycling. Much of the change is due to the European Union (EU) Directives regarding these issues. The RoHS and REACH directives have caused many suppliers to the industry to rethink their materials and processes. Thus, everyone designing or producing electronics has been or will be affected.

Target group: Managers & Engineers representing the PCB Design, Manufacturing, Process Planning and Development and Failure Analysis functions.

To learn more about the conference, click here.

To register, click here.

For the conference flyer, click here.

No comments:

Post a Comment