DfR's Cheryl Tulkoff to present IPC APEX Professional Development Course on DFM

Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM

PD08: Design for Manufacturing

Presenter/Committee Chair(s):
Cheryl Tulkoff, Senior Member tech staff, DfR Solutions

Topic/Track: Design

Event Type: Professional Development

Level: Intermediate

Gain first-hand information on issues that impact both leaded and lead-free manufacturability and performance requirements; the course will offer practical recommendations for meeting the challenges of managing the interconnection of both through-hole and surface mount technology at the bare board level. Increasingly sophisticated PCB fabrication technologies and processes will be discussed, including: laminate selection, trace width and spacing, solder mask and finishes. Design for manufacturability (DFM) best practices ensure that manufacturing capability is taken into consideration during the design and layout of a product. Understanding the effects of - and how to avoid - overtaxing their manufacturer, engineers can be more confident about design execution. Participants will gain a greater understanding of potential manufacturability hazards to avoid during the design process.

What You Will Learn

• Printed boards and process material selection
• Plated-through hole design
• Conductor width and spacing
• Keep-out zones
• Copper balancing
• Microvias, via fill technologies
• Multiple lamination
• Equipment process controls and reliability testing
• Matching PCB complexity to supplier capabilities
• Partnering and off-shore strategies
• Importance of supplier report cards to monitor quality and reliability
• Cover circuit card assemble
• Pad geometries, component spacing and location
• Heat sink selection
• Standoffs and wiring
• Influences of PCB thickness, cut-outs, and depanelization techniques on reliability
• Comparison of surface mount, wave and hand soldering
• Moisture Sensitivity Level handling, process optimization and control strategies, repair and rework.