Thursday, January 5, 2012

DfR's Cheryl Tulkoff to present IPC APEX Professional Development Course on DFM

Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM
Presenter/Committee Chair(s):
Cheryl Tulkoff, Senior Member tech staff, DfR Solutions
Topic/Track: Design
Event Type: Professional Development
Level: Intermediate
Gain first-hand information on issues that impact both leaded and lead-free manufacturability and performance requirements; the course will offer practical recommendations for meeting the challenges of managing the interconnection of both through-hole and surface mount technology at the bare board level. Increasingly sophisticated PCB fabrication technologies and processes will be discussed, including: laminate selection, trace width and spacing, solder mask and finishes. Design for manufacturability (DFM) best practices ensure that manufacturing capability is taken into consideration during the design and layout of a product. Understanding the effects of - and how to avoid - overtaxing their manufacturer, engineers can be more confident about design execution. Participants will gain a greater understanding of potential manufacturability hazards to avoid during the design process.

What You Will Learn
  • Printed boards and process material selection
  • Plated-through hole design
  • Conductor width and spacing
  • Keep-out zones
  • Copper balancing
  • Microvias, via fill technologies
  • Multiple lamination
  • Equipment process controls and reliability testing
  • Matching PCB complexity to supplier capabilities
  • Partnering and off-shore strategies
  • Importance of supplier report cards to monitor quality and reliability
  • Cover circuit card assemble
  • Pad geometries, component spacing and location
  • Heat sink selection
  • Standoffs and wiring
  • Influences of PCB thickness, cut-outs, and depanelization techniques on reliability
  • Comparison of surface mount, wave and hand soldering
  • Moisture Sensitivity Level handling, process optimization and control strategies, repair and rework.

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