Showing posts with label electronics. Show all posts
Showing posts with label electronics. Show all posts

Tuesday, January 10, 2012

DfR Solutions at 2012 SMTA Houston Expo


Please join us for our 2012 Houston SMTA Expo & Tech Forum at the Stafford Centre, 10505 Cash Road, Stafford, Texas 77477. Come see what the industry has to offer in new products and services with over 60 tabletop exhibitors. The Expo will be held in Ballroom A through C and the Tech Forum will be held in Room 104 and 105. Free lunch catered by the Black Eyed Pea.


We are pleased to offer an outstanding technical program this year:

11 AM Flex Circuit Design for Reliability

Speaker: Steve Kelly, PFC Flexible Circuits Limited

Abstract: The design of flexible circuits presents a challenge to those who are primarily familiar with rigid boards. This presentation discusses the construction of six basic types of flex and rigid flex circuits and the properties of the materials that they are made from. Flex circuits have special layout rules due to the fact that they will be bent in the application, and because the material properties create unique challenges in assembly. The major differences between flex and rigid board layouts will be discussed, as well as a short primer on design for impedance control in flex circuits.

Speaker: Steve Kelly is the President and founder of PFC Flexible Circuits Limited in Toronto, Ontario. He has been involved in the design and manufacture of flex and rigid flex circuits for 28 years. Steve holds a Bachelor’s degree from McMaster University and an MBA from the University of Western Ontario.

Abstract: A long-time need for high temperature solders has existed in many industries including industrial controls, aerospace, and oil exploration. Basic material requirements have typically been ease of assembly, resistance to creep, low cost, and more recently Pb-free. Now may be the perfect time to rethink some of these past approaches. This presentation will review traditional approaches and some variations, then expand into some of the many alternative methodologies that are in recent use as well as those under development or being evaluated.

Speaker: Cheryl Tulkoff is an industry renowned expert in the fields of semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. At her most recent position at National Instruments, Cheryl developed a comprehensive reliability organization, including the creation of an internal failure analysis group and a closed loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication through her work at Cypress Semiconductor in electronics assembly, and through her work at IBM. Cheryl is the head of DfR’s newest office located in Austin, Texas, which opened in February 2009.



Abstract: Over the past few years, the test philosophy has changed from ICT (in-circuit testing) to flying probe testing due to the cost of fixturing and required engineering resources. This presentation will review the history of automated test systems, how far technology has advanced the capabilities of flying probe testing and how to develop a test strategy to ensure best overall test coverage and throughput.

Speaker: John Oaf is Applications Manager for the Takaya Group at Texmac, Inc. He has over 24 years experience in production testing at GenRad, Inc. and Teradyne, Inc.

FREE LUNCH and LOTS OF DOOR PRIZES


2012 Show Schedule

10 a.m. Expo open to attendees

11:00 a.m.-11:45 a.m. Technical Presentation

Topic: Flex Circuit Design for Reliability

Speaker: Steve Kelly, PFC Flexible Circuits

11:45 a.m. Door prize drawing

12:15 p.m. - 12:45 p.m. – Free Lunch

12:45 p.m. - 1:00 p.m. - Random Drawings for Gift Certificates and Special Mid-Day Prize

(must be present to win)

1:00 p.m. - 1:45 p.m. Technical Presentation

Topic : Advances & Challenges in High Temperature Component Attachment

Speaker: Cheryl Tulkoff, DfR Solutions, LLC

1:45 p.m. Door prize drawing

2:00pm-2:45pm Technical Presentation

Topic: How Flying Probers Optimize Test Strategy

Speaker: John Oaf, TEXMAC Inc.

2:45 p.m. Door prize drawing

3:00 p.m. - 3:15 p.m. - Random Drawings for Gift Certificates and Special Afternoon Prize (must be present to win) 3:15 p.m. - 3:30 p.m. - Drawings for Bingo Prize (need not be present to win)

Drawing for Free Booth for 2013 (exhibitors only) 3:00 p.m. - 5:00 p.m. - Networking Reception - Beverages and Snacks - no charge

We look forward to seeing you at the Expo on February 9! Please register on-line or call the SMTA at (952)920-7682. For exhibitors, we have extended the early-bird rate until January 31.

Monday, October 3, 2011

IPC Webinar on Oct. 20 for "Electronics Failure Analysis: Common Mechanisms & Techniques"

Electronics Failure Analysis Common Mechanisms & Techniques
Cheryl Tulkoff, DfR Solutions
Thursday, October 20
10:00 am-11:00 am, Central time


Effective failure analysis is critical to product reliability. Without identifying the root causes of failure, true corrective action cannot be implemented. The risk of repeat occurrence increases. A systematic approach to failure analysis is recommended, proceeding from nondestructive to destructive methods until all root causes are conclusively identified. Choosing the appropriate techniques based upon failure information (history, mode, site, failure mechanism) specific to your product is also critical. Learn how to choose the appropriate techniques based upon the failure information.

What you will learn

Failure Mechanisms
  • On-die mechanisms (ESD, electro-migration, TDDB, passivation & dielectric cracking)
  • First-level packaging (wirebonds, solder bumps, substrates, leadframes)
  • Support structures (die attach, underfill, encapsulant)
  • Solder joints (thermal fatigue, IMC growth, solderability)
  • Board level (passives, PCB, CAF, PTH, tin whiskers, finishes)
Failure Analysis Techniques
  • Failure analysis sequence
  • NDE techniques (visual, optical, electrical, thermal, acoustic, X-ray, SQUID)
  • Destructive techniques (decapsulation, etching, cross-sectioning, SEM, EDX, XRF, Auger, SIMS, FIB, electrical and optical beam techniques)
  • Others (FTIR, DSC, TMA, ionic chromatography)
About the Instructor

Cheryl Tulkoff is a senior member of the DfR Solutions Staff. Her areas of expertise include semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. Prior to joining DfR, Tulkoff developed a comprehensive reliability organization at National Instruments including creation of an internal failure analysis group and a closed-loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication in electronics assembly at Cypress Semiconductor and IBM.

Wednesday, January 26, 2011

Central Texas Electronics Association Symposium - Tuesday, February 22nd




Central Texas Electronics Association
 
Electronics Design & Manufacturing Symposium 
Tuesday, February 22, 2011
AMD Bldg B500 at 7171 Southwest Parkway

Program:

3:00 - Registration Begins

3:30 - Welcome and Introductions

3:35 - "Lead-Free Chip-Package Interaction Reliability Overview"

Lei Fu, Advanced Micro Devices (AMD)

4:05 - "Improving System Reliability with SynJet Cooling"

Dr. Markus Schwickert, CRE, Nuventix

4:35 - Break & Networking

4:45 - "Counterfeit Components – Avoidance and Detection”

Jason Jowers, Velocity Electronics

5:15 - "AC Power Electronics for Rooftop Solar"

Terence Parker, SolarBridge Technologies

5:45 - Closing Remarks

6:00 - Food & Refreshments Served and More Networking

Registration:

RSVP to Bob Baker at: rjbakeratx@austin.rr.com

There is no charge for SMTA and IMAPS members; $10 for all non-members

Event Location:

AMD Bldg B500 at 7171 Southwest Parkway in South Austin

near Southwest Parkway and West William Cannon Dr (Use Parking Garage P100)

See Map at: (Map to AMD) Or: See attached doc.

In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)