Friday, January 6, 2012

DfR Chairing Pad Cratering Session at IPC APEX Expo on Thu, Mar 1, 2012

Thu, Mar 1, 2012 - 10:15 AM to 11:45 AM
Presenter/Committee Chair(s):
Jim Griffin, OEM Marketing Mgr, Integral Technology
Cheryl Tulkoff, Senior Member tech staff, DfR Solutions
John McMahon, Engineering Operations Consultant, Celestica
Anurag Bansal, Cisco Systems Inc.
Topic/Track: Assembly Processes for Lead Free and Tin Lead
Event Type: Technical Conference Session

In the switch to lead free, one of the unpleasant side effects of the use of higher temperatures in assembly has been pad cratering. This session brings in experts from assembly who will discuss tests to predict and diagnose pad cratering. If you have had a lead-free process "crater," then the information in this session is what you need!

The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
, John McMahon
Investigation of Pad Cratering in Large Flip-Chip BGA Using Acoustic Emission, Anurag Bansal
Pad Cratering, Jim Griffin
If you are registered for the All-Access Package or for the Full Conference, attend any conference session. If you are registered for the One-Day Conference, please note that you will only be allowed into the conference sessions occurring on the day of your badge. To register for all conference sessions, return to your registration and select the All-Access Package or the Full Conference.

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