Tuesday, November 15, 2011
New Technologies in Electronic Packaging: Munich, Germany: November 17
Craig Hillman will be presenting a half day course addressing topics such as Copper Wire Bonds, Through Silicon Via (TSV), Copper Pillar, Stacked Die, and Bottom Terminated Components (BTC). He will also be visiting customers in Germany. If you would like to arrange a visit, please contact June Caswell, email@example.com.