Monday, November 21, 2011

Electronics Packaging Technology Conference in Singapore: December 7

DfR Solutions will be teaching a NEW full-day course titled "Reliability Predictions for Packaging and Tools for Analyzing Risks and Grading Packages at Board Level" at the Electronics Packaging Technology Conference. The course will be in two parts with the first addressing semiconductor packaging and the second board level reliability. For more information please contact Craig Hillman,

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