As parts get smaller and smaller and the pitch between contacts gets closer and closer, assuring reliability during manufacturing becomes more and more difficult.
To successfully move to 0.3mm pitch requires buy-in from the entire manufacturing industry, from the printed board manufacturer, to the solder paste supplier, to the stencil manufacturer, and a comprehensive understanding of the potential reliability risks that the change in interconnect design may entail.
Attend this informative webinar presented jointly by ITM Consulting and DfR Solutions, a leading provider of quality, reliability, and durability research and services for the electronics industry, and learn about this issue from the perspective of the manufacturing and reliability.
Don't miss out! Early Bird Registration here.
To learn more about DfR Solutions, click here.