Randy Schueller will be presenting "Design for Reliability: The Next Generation" at the IPC Midwest Conference on Thursday, September 30th at session S05. For more information or to arrange a meeting during the conference, please contact Randy Schueller, rschueller@dfrsolutions.com .
S05 Design for Reliability (DfR) and Failure Analysis
Thursday, 9/30/2010 8:00 AM - 12:00 PM
Moderator: John Radman, Trace Laboratories East Denver
Turn on the news these days and see how quality recalls can detrimentally affect the confidence and loyalty customers have for a company’s product. This session will cover various failure modes, identify high risk assembly processes, and outline physics of failure (PoF) principles and other critical prevention strategies in DfR that need to be implemented to product a defect-free quality product.
ESD Control for the Automotive Electronics Industry
Gerry Pedone, Delphi Electronics & Safety
Strategies for the Prevention of Board Strain and Cracked Chips in Automotive Electronics
Steve Davidson, Delphi Electronics & Safety
Reliable Solder Identification by X-ray Fluorescence Spectroscopy
Ronald Glaser, CMG Sales/Fischer Technology, Inc.
Design for Reliability: The Next Generation
Randy Schueller, DfR Solutions
Die Attach Solder and Solder Alternatives
Brian Toleno, Ph.D., Henkel Corporation
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