Wednesday, August 29, 2012

Join Me At SMTA International in Orlando on Mon, October 15 for a Pad Cratering Tutorial!

Pad Cratering: Prevention, Mitigation, and Detection Strategies

Monday, October 15, 2012, 8:30am to 12pm EDT

Pad cratering is defined as cracking which initiates within the laminate during a dynamic mechanical event such as In Circuit Testing (ICT), board depanelization, connector insertion, and other shock and vibration inducing activities. 

In this course, you'll learn the key drivers, measurement and detection protocols, and preventive tactics for this serious but prevalent failure. Pad cratering was first recognized in BGA packages but newer leadless,bottom termination components are also vulnerable. 

Who Will Benefit
Design, manufacturing, and failure analysis engineering professionals

Topics Covered
  • Introduction
    • Pad cratering defined
    • Pad cratering drivers
    • Is pad cratering a Pb-free issue?
    • At-risk components
  • Testing methodologies
    • Overview of IPC industry test standards
    • Alternative test methods
  • Detection methods
    • Overview of IPC industry test standards
    • Alternative test methods
  • Failure analysis techniques
    • Cross-sectioning
    • Dye-N-Pry
    • X-ray
  • Mitigation techniques
    • ICT fixture evaluation
    • Assembly process evaluation
    • Process specifications
    • More compliant solder
    • New acceptance criteria for laminate materials
    • Require reporting of fracture toughness and elastic modulus
  • Prevention methods & future work
    • Board redesign
    • Zeta cap

Don't miss out! Register here.

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