Monday, May 30, 2011
Package on Package: DfM / DfR, Part 1
After years of incubating inside short-life, high-volume consumer products, package-on-package (PoP) is ready to make the leap to mainstream products. Just like QFNs , this new part type can bring on manufacturability and reliability challenges. For more information on solutions to these challenges, please contact Cheryl Tulkoff, email@example.com.