Monday, May 30, 2011

Package on Package: DfM / DfR, Part 1

After years of incubating inside short-life, high-volume consumer products, package-on-package (PoP) is ready to make the leap to mainstream products. Just like QFNs , this new part type can bring on manufacturability and reliability challenges. For more information on solutions to these challenges, please contact Cheryl Tulkoff,

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