Monday, March 28, 2011

Reballing Ball Grid Arrays (BGAs)

With electronics components decisively shifted to Pb-free, it is becoming difficult to buy components with tin-lead (SnPb) solder balls. The only three responses? Custom order (only if you want >1 million), adapt (seen any Pb-free planes?) or post process (reball). This paper presents the results from a comprehensive study on the ability of reballed BGAs to survive severe environments. Please contact Joelle Arnold,, for more information.

No comments:

Post a Comment