Dr. Nathan Blattau, Vice President and Chief Scientist at DfR Solutions, will be in Phoenix, Arizona, Monday, March 8, through Thursday, March 11, to present at the iMAPS Device Packaging Conference.
His presentation, entitled, "The Introduction of Tensile Ratcheting in Solder Bumps Encapsulated in Low Tg Underfill," will discuss how unique stress states present with low Tg underfill can result in rapid times to failure in relatively benign environments.
While Dr. Blattau is in the area, he will be available to visit interested companies to give complementary presentations on a variety of topics including modeling component packaging behaviors, Pb-free reliability, and design-for-reliability assessments using DfR’s newest software tools. He would be more than happy to include your company in his visit.
If you are interested in arranging an onsite presentation, or if you would like more information regarding DfR’s services, please contact Carrie Sharik-Ernest, Manager of Marketing, csharik@dfrsolutions.com
Subscribe to:
Post Comments (Atom)
Posts
No comments:
Post a Comment