Attend the IPC AHOT October 9th Chapter Meeting!

Upcoming Chapter Meeting October 9, 2012, 6 P.M.

"Managing PCB Design Constraints with Constraint Manger and SigXplorer"
Presented by Leonard Toohey, Cisco

“Release or Re spin Importance of checking your Design”
Presented by Cynthia Black, IXIA | Network Visibility Solutions

We are having two different presentations. Pizza and drinks will be provided. RSVP to Linda at  512-259-2465 , or email linda@kutzsales.com

Location:
Cadence Design Systems, Inc. 12515-7 Research Boulevard, Ste 250
 512-349-1100  Austin, Texas 7875

Texas ESDA hosts a Lightning Presentation in Austin on Mon, Oct. 29, 2012 at 3pm

This message is being directed to ESD Professionals

This is being sent to individuals in our Texas distribution and on ESDTalk

For more information regarding Texas ESD Association activities, please go to the following

WEB page:   http://centxesdassoc.homestead.com/

Lightning Presentation in Austin

October 29, 2012  Mon 3pm

October 29, 2012  Mon 3pm - Lightning presentation in Austin -Nevada Lightning Lab and Myth-busters presentation explores the unusual ability of natural lightning to 'cheat’ classical physics... throwing arcs kilometres in length with less than a tenth of the voltage gradient required to produce normal laboratory arc discharges.  Although researchers don't fully understand how lightning performs this trick, new theories and a few tantalizing experimental results suggest that relativistic effects [and possibly the presence of antimatter] can greatly enhance lightning formation at physical scales beyond about 60 meters in length.

Presenter will be Greg E. Leyh is the principal engineer for the Lightning Foundry, a research facility for exploring the large-scale physics of atmospheric electricity.  He designed the Electrum Project, a 38ft high kinetic lightning sculpture currently operating in New Zealand. 

Presentation will be at the 3M Innovation Center, Hill Country Room.  AUSTIN TX

There is not a charge for the meeting but we do need an RSVP with name, company, & phone for security badges ands room planning.

Your 2012 Texas ESD Association Board of Directors

Ray Bowman  - City of Austin - President / Webmaster 
Ginger Hansel,  Dangelmayer Associates L.L.C.  - V.P. Education 
Jason Jowers, Velocity Electronics - V.P. Membership 
David Swenson, Affinity Static Control Consulting, LLC - Treasurer / National Liaison 
Gary Sutorius, Stanley Consultants - Secretary 
Frank Rodriguez,  3M Corp., - Member at Large 
Jeff Salisbury, FLEXTRONICS, Member at Large

Fred Bahrenburg, Dell Inc., Member at Large

Bob Renker, Temple College/Retired TI - Board Advisor

Gilbert Koss,  Retired 3M - Board Advisor

DfR Solutions' Randy Schueller will be in the Phoenix & Tucson areas September 26-28

Randy Schueller will be visiting companies and clients in the Phoenix and Tuscon areas and will be available to discuss a wide range of topics, including copper wire bonds, electronic materials, PCB manufacturing and failure modes, and best practices in component selection. For more information or to arrange a visit to your facility, please contact June Caswell .

DfR Solutions' Randy Schueller presents at MEPTEC & SMTA Medical Electronics Conference in Tempe, AZ: Sep 26-27

Randy Schueller will be making a presentation entitled "Leveraging Existing Market Knowledge to Ensure a Successful Transition to Pb-free," at this conference. For more information contact Randy Schueller. For arranging a visit to your company while Randy is in the area, contact June Caswell.

Free webinar on Sept 27: Overcoming 25 Year Life Reliability Challenges in Solar Electronics

Join us for a Webinar on September 27 Space is limited. Reserve your Webinar seat now at: https://www3.gotomeeting.com/register/273328062 Title: Overcoming 25 Year Life Reliability Challenges in Solar Electronics. Date: Thursday, September 27, 2012 Time: 12:00 PM - 1:30 PM EDT After registering you will receive a confirmation email containing information about joining the Webinar. Solar panels and their components are exposed to extreme environmental conditions during their lifetime. How can you ensure that your solar power module will be performing reliably all that time? Imagine being able to predict product reliability 25 years into the future! In this webinar, you will learn how you can predict the failure rate of the electronics components found in Solar inverters and micro-inverters, helping you ensure that the expected life of your products meets your customers' requirements. Before a circuit board is ever built, learn how to predict failure due to thermal stresses, vibration, and shock, saving you time, money, and extending your product lifetime. System Requirements PC-based attendees Required: Windows® 7, Vista, XP or 2003 Server Macintosh®-based attendees Required: Mac OS® X 10.5 or newer Mobile attendees Required: iPhone®/iPad®/Android™ smartphone or tablet

DfR Solutions at PCB West in San Francisco, CA: September 25-27

DfR Solutions will have a booth at this important conference. Visit with Ed Dodd while at the conference or, if you would like us to visit your facility, please contact June Caswell.

Austin (CTEA) Expo and Tech Forum on Wednesday September 26, 2012

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Register now for free!

 
Free Technical Program & Schedule:

10:00AM – 11:00AM
Expo / Registration Opens

11:00AM -11:45AM
Speaker: John Pirc, Enterprise Security Product Management Director, HP-TippingPoint Title: Next Generation Cyber Threats – Shining the Light on the Industries’ Best Kept Secret

NOON – 1:00PM
FREE Lunch, Networking, and Door Prize Drawings

1:00PM- 1:45PM
Speaker: Christian Best, Founder, Green Revolution Cooling Title: Submersion Cooling in the Datacenter - How, Why, and Lessons Learned

2:15PM – 3:00PM
Speaker: Sergio Juarez, Sales Manager, FCT Assembly Title: Impact of Strain on Lead Free Alloys’ Reliability

3:00PM – 3:30PM
Afternoon Refreshments, Networking, and Door Prize Drawings

3:30PM – 4:15PM
Speaker: Ted Perna, Engineering Manager, Micropac Industries Title: Multi-Chip Module Technology Overview

4:15PM – 5:00PM
Expo Closes



Current Exhibitor List:

Amitron Corporation ASM Assembly Systems, LLC Bare Board Group Compunetics, Inc. Conductive Containers Inc. (CCI) Ducommun LaBarge Technologies, Inc. Eatman Associates Electrotek Corporation Endicott Interconnect Technologies FHP Reps, LLC Global Stencil, Inc. GSC (Garland Service Company) iRex Group, Ltd. KEYENCE Corporation Krayden, Inc. KutzSales Libra Industries, Inc. Multicircuits

National Circuit Assembly PAC Global Panasonic Factory Solutions of America Prototron Circuits QC Graphics, Inc. REStronics Southwest SMEC, INC. Southwest Systems Technology Inc. SPEA America Specialty Coating Systems STI Electronics, Inc. SVTronics, Inc. Systronix, Inc. TLS Technologies Trace Laboratories, Inc. UStx Contract Services Venkel Ltd. ZESTRON

DfR Solutions' Craig Hillman presents at Darnell's Power Forum in San Jose, CA: September 19-21

Craig Hillman will be making a presentation entitled "Using Physics and Industry Best Practices to Predict the Lifetime of LED Power Supplies" at this special conference on Power Electronics.

Please help iNEMI identify critical components for medical devices! Deadline is October 1st!

Please don't forget to give us your input on the iNEMI survey, Identification of CriticalComponents for Medical Devices. If you personally do not work with the medical electronics sector, but there is someone else in your company who does, please forward this email to the appropriate contact.  

About the Survey 

This survey was developed by the iNEMI Component Specifications for Medical Products Project. The project team plans to identify and define a set of component-level reliability qualification methods for electronic components used in implantable and wearable medical devices. Their goal is to develop much-needed specifications that can be accepted by device OEMs as well as supported by component suppliers.

The survey will be used to determine the selection of the most relevant components to be considered by the project team. We appreciate your taking 10 minutes to give us your input.

Survey Results

Please note that all survey responses go directly to iNEMI and all information in the survey will be treated as confidential. All results will be anonymous. Individual demographic information will not be shared with the project team or others. Individuals who complete the survey and provide contact information will receive a summary of the results from the iNEMI project team after their analysis of the data is complete in Q1 2013

It's not too late to learn ' A New and Better Approach to Tin Whisker Mitigation"! Join me At SMTA International in Orlando on Monday, Oct 15th!

 A New and Better Approach to Tin Whisker Mitigation NEW! 

Register Now!

Monday, October 15 | 1:30pm – 5:00pm | Europe 9


Course Objectives
Tin whiskers are hair-like single crystal metallic filaments that grow from tin films. Their unpredictability is the greatest concern and the Aerospace and Defense industries consider tin whiskers the, "greatest reliability risk associated with Pb-free electronics".
The potential failure modes include:
- Direct contact causing an electrical short (arcing). This requires whisker growth of sufficient length and in the correct orientation
- Electromagnetic (EM) Radiation where the whisker emits or receives EM signal and noise at higher frequencies and causes deterioration of the signal for frequencies above 6 GHz. This is independent of whisker length.
- Debris which results from a whisker which breaks off and shorts two leads (primarily during handling). Mitigation efforts can fail when only one source of stress is accounted for. For example, if a Ni layer is used to prevent stress from IMC formation, this will not address whisker formation due to corrosion or external pressure.
All the potential sources of stress for a particular application should be considered in the whisker mitigation process. The various sources of compressive stresses that drive whisker growth are rather well understood but to effectively mitigate tin whisker growth one needs to ensure actions are taken to address ALL sources of stress in an application. A checklist can be used as an aid in this endeavor. This approach would offer a more cost effective and better method of whisker management than the current focus on long term environmental testing.
Who Will Benefit
Design engineers, component/supplier quality engineers, reliability engineers
Topics Covered

What are tin whiskers?

What are the potential failure modes?

Where have tin whiskers caused failure?

Root causes of whiskers

Drivers

Mitigation

Sources of compressive stress

New approach to mitigation

Proposed checklist

Discussion

Summary

It's not too late to Learn About Pad Cratering Detection and Prevention! Join Us At SMTA International in Orlando.

Join Us At SMTA International in Orlando:
Monday, October 15, 2012, 8:30am to 12pm EDT 

Pad Cratering: Prevention, Mitigation, and Detection Strategies 

Pad cratering is defined as cracking which initiates within the laminate during a dynamic mechanical event such as In Circuit Testing (ICT), board depanelization, connector insertion, and other shock and vibration inducing activities. 

In this course, you'll learn the key drivers, measurement and detection protocols, and preventive tactics for this serious but prevalent failure. Pad cratering was first recognized in BGA packages but newer leadless, bottom termination components are also vulnerable.  

Don't miss out! Register here.