Sunday, July 22, 2012

Process and Design Guidelines for QFNs: Manufacturability and Compatibility

What happens when the fastest selling component package in the world is dreaded and feared by long-life, high-reliability OEMs? Its time for a DfR White Paper. In this report, we discuss the quad-flat-pack-no lead (QFN),explain the drivers for its adoption, and some of the design and process rules that must be applied to ensure a trouble-free transition. For moreinformation, contact Cheryl Tulkoff.

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