Thursday, May 24, 2012
Through Silicon Vias (TSV)
3D packaging is upon us, at least that is the prevalent view based on recent announcements. However, reliability of a key element in this technology, through silicon vias (TSVs), has not always been fully addressed. In his highly opportune presentation entitled "Predicting the Reliability of ZeroLevel TSVs," Greg Caswell reviews the latest knowledge on TSV failure mechanisms and how they can influence device performance. For more information or to learn how to work with DfR on incorporating this technology into your product, contact Greg Caswell.