Thursday, March 15, 2012

DfR Solutions' Craig Hillman authors Package on Package Article

PoP packaging is quickly evolving into one of the next generation packaging technologies due to the increased need to miniaturize electronics. To get a flavor for the issues associated with the manufacturability of assemblies utilizing these packages, read DfR's recent article published in the SMT February 2012 issue. For more information, contact Craig Hillman.

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