Lead-Free Reliability Workshop: Oct. 31st in Irvine, CA

IPC Conference on Reliability:
ASSEMBLY PROCESS for a RELIABLE PRODUCT

LEAD-FREE RELIABILITY WORKSHOP: October 31, 2011

CONFERENCE: November 1–2, 2011 • Irvine, Calif.

This unique event will take you through the assembly process — from materials to test and inspection — and provide you with the latest information so you can increase your reliability.

LEAD-FREE RELIABILITY WORKSHOP

October 31
10:00 am to 5:00 pm
Design for Reliability in the Lead-Free Era

Instructor: Cheryl Tulkoff, Senior Member of Technical Staff, DfR

This workshop provides a focused but comprehensive discussion of all issues that can arise during the transition to lead free. All areas of potential risk will be examined, including:
• popcorning
• tin whiskers
• plating failures associated with various solder materials
• plated-through hole (PTH) barrel cracking
• pad cratering
• thermomechanical wearout
• high-cycle fatigue

For each reliability concern, the latest research will be shared and you will learn the best ways to mitigate risk based on a product's design, materials, complexity, volumes and customer expectations of reliability. A final summary will provide you with a roadmap for ensuring the reliability of your lead-free product.

Who Should Attend?
This course is designed for engineers and manufacturing personnel who need to fully comprehend the characteristics of design for reliability (DFR) and how it applies to unique applications.

Register Now!