Upcoming IPC Webinar- High Reliability: Solving Problems with Reliability, Repair and Rework in the Lead-Free Era

High Reliability: Solving Problems with Reliability, Repair and Rework in the Lead-Free Era
Cheryl Tulkoff, DfR Solutions
Wednesday, February 16
10:00 am–11:00 am, Central time
This presentation provides a focused but comprehensive discussion on potential reliability issues that can arise within lead-free processes. All areas of potential risk are examined. For each reliability concern, a brief description is provided, followed by the current state of industry knowledge and an opportunity for risk mitigation based upon the product design, materials, complexity, volumes and customer expectations of reliability. A final summary provides a roadmap for ensuring reliability of lead-free product.

What You Will Learn

SAC — background and alternative alloys PCBs — surface finishes, laminates, PTH barrel cracking and CAF, pad cratering, ECM Components — concerns, moisture and temperature sensitivity Solders — second generation alloys, copper dissolution, mixed assembly Wave and Rework — lead-free solder fountain, hole-fill challenges Reliability — shock/drop test results, SAC vs. SnPb, results of alternative alloys, thermal cycling Fatigue — shock and vibration, microstructural stability, HALT/HASS

About the Instructor
Cheryl Tulkoff has over 15 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no-clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs. Tulkoff earned her Bachelor of Mechanical Engineering degree from Georgia Tech and is an ASQ Certified Reliability Engineer.