On page 35, a photo of me giving a presentation to the Central Texas Chapter on "Manufacturability and Reliability Challenges with QFN" made it into the new iMAPS Advancing Microelectronics magazine.
The November/December 2009 issue features 4 technical articles on: NanoBond Assembly - A Rapid, Room Temperature Soldering Process; Can Current EDA Packaging Tools Meet the Demands of Ever-Changing 3D Packaging Technologies?; Thermal Management for LED Pico Projectors; and Conformal 3D Electronics: the Future of Consumer and Medical Products.
A link to the magazine can be found by clicking here.
For more information of future Central Texas events, please click HERE.
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