DfR Solutions at NEBS Conference in Las Vegas, NV: October 23-24

DfR's Ed Dodd will be attending the NEBS 2012 Conference: Common Requirements for Uncommon Networks on qualifying product for the Verizon supply chain. If you would like to meet with us during the conference, please contact June Caswell.

Verizon Communications will host its 18th annual NEBS Conference in Las Vegas, Nevada on October 23-24, 2012. Co-Sponsored by UL, a Verizon-certified independent testing laboratory, and held at the JW Marriott Las Vegas Resort and Spa, NEBS 2012 represents a unique opportunity for you to learn how service providers are transforming their networks to create new services that drive revenue creation and cut cost.

The traditional model of NEBS testing has served telecom providers well for the past two decades. In the case of Verizon and its predecessor companies, it has not experienced a non-weather-related service-affecting event since 1987, when a fire that started in the Bushwick Ave CO cable vault spread through the building engulfing everything in its path. Since then, suppliers have done an excellent job sourcing materials that don’t support active combustion and designing equipment chassis capable of containing open flames. This and other enhancements make carrier-grade equipment highly uniform, which supports easy installation, provisioning and maintenance, and reliable for stable performance under normal and extreme operating conditions.

Fast forward to today and we see that technologies and materials have evolved along similar lines as improved vendor management, maintenance programs, network surveillance, redundancy and geo-diversity; collectively, these initiatives reinforce Verizon’s service delivery operations.  These evolutions, however, highlight a need to reexamine the current NEBS policies in both application and scope so as to reposition these policies to reflect the current realities and the ‘yet-to-be-created’ networks used to connect our global customers.

Join us at NEBS 2012 to learn more about the changes affecting the telecom industry. This one-of-a-kind event is the best place to meet with service providers, lab partners and the talented engineers who design, manufacture and test products for end-users everywhere. Equipment suppliers, independent test labs and system integrators will all find value in attending this two-day conference and networking event.

DfR at NDIA Conference at San Diego, CA: October 22-25

Walt Tomczykowski will be attending the National Defense Industrial Association Systems Engineering Conference in San Diego October 22-25. If you would like to arrange a meeting with Walt at the conference, contact June Caswell.

Upcoming Publication in Chip Scale Review

Nathan Blattau and Craig Hillman will have an article entitled "Designing and Qualifying Chip Scale Packages" published in the upcoming issue of Chip Scale Review. The race to keep up with Moore's Law through packaging has resulted in an expansion of the very concept of a chip scale package. This includes the recent introduction of silicon interposers, through silicon vias, and embedded die designs. Be on the lookout for this informative article.

Engineers 1, Doctors 0

Cocktail parties may be excruciating, but as this video shows, engineers always have one thing up their sleeve (wait till the very end).

Drop and Give Me Twenty!

In this white paper, DfR provides an introduction to Drop Testing and how it can be utilized to ascertain component package robustness. To learn more about this testing approach, contact Melissa Keener.

Qualifying Optical Transceivers

Over the past several years, an approach was formalized to support the reliability assessment of integrated photonic modules (specifically, optical transceivers). The details and justification of this approach is described in this white paper. For more information on DfR Solutions' expertise in photonic devices, contact Gregg Kittlesen.

Are 0201 Components Really Being Used?

In 2010, DfR performed a ground-breaking industry survey on the use of small (0201 / 01005) chip components that clearly showed the limited penetration of this technology. After two (2) years, it is now time to update this crucial information. Fill out this short survey (only five minutes!) and you will receive a summary that helps you make the right decision on 0201s for your next design. For more information, contact Cheryl Tulkoff.