From Concept to Customer: Comprehensive Review Methodology

DfR has documented a comprehensive review methodology for a Product Delivery Process (PDP) that involves the entire product life cycle from design to manufacturing to delivery. The approach utilizes well established "Benchmarking," "Organizational Re-Engineering" and "Lean Process" evaluation methods. The intent is to identify the various steps in a company's current PDP and to benchmark their effectiveness and efficiency to best-in-class organizations. For more information on how DfR can help your organization become a market leader, contact Cheryl Tulkoff, ctulkoff@dfrsolutions.com.

DfR Solutions in Dayton, OH on March 1-2

Craig Hillman will be visiting companies in the Dayton, OH area in early March. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell,jcaswell@dfrsolutions.com.

How to Design for Thermal Cycling: Upcoming iMAPS Webinar

In collaboration with iMAPS, DfR Solutions will present a broad-based webinar on the challenges of designing for an environment with changing temperature. Whether your product is military, industrial, or part of the 'Free Air Cooling' trend, this insightful presentation will identify all of the mechanisms affiliated with thermal cycling and how to rapidly assess these risks during product design. To register, please contact Brian Schieman, bschieman@imaps.org. For more information, contact Nathan Blattau, nblattau@dfrsolutions.com.

Beyond Bearing Wearout: Solving Fan Reliability

Fans continue to be a liability in the long-term reliability of electronic systems. To address this risk, DfR has developed an accelerated test methodology that is a singular solution for electronic OEMs attempting to select fan suppliers or attempting to determine the root-cause of field failures. By subjecting fans to conditions more applicable to application environment, their true capability and performance can be assessed in a fraction of the time. For more information, contact Tom Johnston.

The Best Way to Stop Tin Whiskers

The electronics industry has struggled to find the right combination of confidence and cost in mitigating the risk of tin whiskers. An excessive reliance on environmental testing has resolved neither of these issues. The real solution, detailed in this white paper, relies on the fundamentals of physics and quality control to put a stop to whiskers once and for all. For more information, contact Randy Schueller.

Design it Better, Launch it Faster, and Satisfy your Customers

After years of development and a successful launch among early adopters, DfR Solutions is launching version 2.0 of its revolutionary electronic design analysis software. This unrivaled product provides the most comprehensive solution available for Physics of Failure (PoF) based analysis of electronic designs. The software's intuitive commands and ease of use invite usage among a broad range of engineers and managers, where rapid results provide almost immediate feedback on product designs and their performance in the hands of the customer. To learn more about a tool that will change the way you design, please join us for our introductory webinar on Thursday, March 31. Registration is now open. For more information, contact Ed Dodd.

DfR Solutions in Detroit, MI February 23rd-25th

Craig Hillman and Jim McLeish will be visiting companies in the Michigan area February 23rd through the 25th. If you and your colleagues would be interested in a visit and possibly a presentation on a range of technical topics, please contact June Caswell.

DfR presenting at G12 Meeting in Tempe, AZ February 17th

G12 Meeting in Tempe, AZ: February 16-17

Craig Hillman and Ed Wyrwas will be presenting "Physics of Failure Approach to Integrated Circuit Reliability" at the G12 Solid State Devices Committee Meeting on Thursday, February 17th. For more information, or to arrange to meet with them, please contact Ed Wyrwas.

DfR Solutions in Phoenix, AZ: February 15-17

Craig Hillman will be visiting companies in Phoenix and Tucson, Arizona February 15th through February 17th. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

DfR Welcomes Dr. Gregg Kittlesen as New Senior Member of Technical Staff

DfR Solutions is proud to announce the hiring of Dr. Gregg Kittlesen to lead its component integrity effort. Located at DfR headquarters in College Park, MD, this effort will provide telecommunication and enterprise OEMs insight and guidance into reliability assessment and risk mitigation for components and modules.

Dr. Kittlesen is internationally recognized as an expert in the fields of optoelectronic device and integrated module reliability engineering. Prior to joining DfR Solutions, he was responsible for component and module reliability evaluation at Ciena Corporation, a leading supplier of network infrastructure solutions. His experience included qualification programs, supplier audits, corrective action resolution, failure analysis, reliability prediction, and prognostic health management. Previous positions at Ericsson Microelectronics and Analog Devices included wafer-level testing and qualification of integrated laser/modulator (DFB/EA) devices, chip product engineering, RF bipolar process integration and qualification, etch/deposition tool evaluation and process development.