CTEA Electronics Design & Manufacturing Symposium

Central Texas Electronics Association (Joint Chapter of IMAPS & SMTA Members) Presents:

Electronics Design & Manufacturing Symposium

Tuesday, April 17, 2012

Virtex Assembly at 12234 N. I-35 & W. Yager Lane, Bldg A

Program:

2:00 - Registration Begins

2:30 - Welcome and Virtex Assembly Factory Overview

2:35 - Virtex Assembly Factory Tours

3:35 - "Conflict Minerals Legislation and its impact on Electronic Manufacturing”

Brad Heath, President, Virtex Assembly

4:05 - "Evolving Counterfeit Component Threats and Industry Mitigation Efforts"

Stephen Schoppe, President, Process Sciences Inc (PSI)

4:35 - Break & Networking

4:50 - "Factors for a Green Cleaning Process”

Ram Wissel, Technology Manager, Kyzen

5:20 - "Green Trends and Innovations in the Electronics Industry"

Albert Tsang, Environmental Affairs, Dell

5:50 - Closing Remarks

6:00 - Food & Refreshments Served and More Networking

Registration:

RSVP to Bob Baker at: rjbakeratx@austin.rr.com

There is no charge for SMTA and IMAPS members; $10 for all non-members

Event Location:

Virtex Assembly at 12234 North I-35 & W. Yager Lane, Bldg A, Austin, Texas

See Map at: (Map to Virtex)

Save the Date: Another CTEA Symposium is scheduled for 6/13 at Cerium Labs

DfR Solutions' Greg Caswell at IMAPS Device Packaging Conference in Scottsdale, AZ: March 6-8

Greg Caswell will be making a presentation entitled, "Predicting the Reliability of Zero-Level TSVs" at the iMAPS Device Packaging Conference in Scottsdale, AZ: March 6-8 For more information, contact Greg Caswell.

DfR at IMAPS Device Packaging Conference in Scottsdale, AZ: March 6-8

Greg Caswell will be making a presentation at the iMAPS Device Packaging Conference entitled, "Predicting the Reliability of Zero-Level TSVs." For more information contact Greg Caswell, gcaswell@dfrsolutions.com

DfR Solutions' Greg Caswell presents at Central Texas Electronics Association in Austin, TX: Feb 21

Greg Caswell will be making a presentation on "Challenges with Package on Package (PoP)" at this local chapter meeting of IMAPS/SMTA and IPC members. For more information contact Greg Caswell.

Central Texas Electronics Association

Electronics Design & Manufacturing Symposium 

Tuesday, February 21, 2012

Freescale Bldg A Conference Center at 7700 W. Parmer Lane

Program:

3:00 - Registration Begins

3:30 - Welcome and Introductions

3:35 - "Comparing Electronic Component Package Materials and Substrate Vendors for

Solder-Joint Reliability Improvements," Joah Rayos, Packaging Engineer, Freescale

4:05 - "Challenges With Package on Package (PoP) Technology"

Greg Caswell, Senior Member of Technical Staff, DfR Solutions

4:35 - Break & Networking

4:45 - "Next Generation Cyber Threats”

John Pirc, Senior Product Line Manager, HP-TippingPoint

5:15 - "Introduction to DSP with the ARM Cortex-M4 Microcontroller"

Sergio Liberman, Senior Microcontroller Systems Engineer, Freescale

5:45 - Closing Remarks

6:00 - Food & Refreshments Served and More Networking

Registration:

RSVP to Bob Baker at: rjbakeratx@austin.rr.com

There is no charge for SMTA and IMAPS members; $10 for all non-members

Event Location:

Freescale Semiconductor Bldg A Conference Center at 7700 West Parmer Lane, Austin, Texas

See Map at: (Map to Freescale)

DfR's Greg Caswell at IMAPS Symposium in Long Beach, CA: October 9-13

Greg Caswell will be presenting two workshops at the IMAPS Conference - S5: Understanding Failure and Root-Cause Analysis in Pb-Free Electronics, and M12: An Electronics Expert Reliability Analysis Tool. In addition Greg will be presenting The Reliability Impact of Reballing COTS Pb-Free BGAs to Sn/Pb for Military Applications and Manufacturability & Reliability Challenges with Leadless Near Chip Scale Packages in Pb-Free Processes.

CTEA Tech Symposium Aug. 2 at National Instruments

Central Texas Electronics Association (Joint Chapter of IMAPS & SMTA Members)

and IPC Austin Heart Of Texas Designers Council Presents:

Electronics Design & Manufacturing Symposium

Tuesday, August 2, 2011

National Instruments, Bldg-C, 11500 N. MoPac

Program:

3:00 - Registration Begins

3:30 - Welcome and Introductions

3:35 - "Commercializing Nanofabricated Devices for Drug Delivery – Is It Actually Possible?"

Randy Goodall, CEO, NanoMedical Systems

4:05 - "Fluid Flow Mechanics – Key to Low Standoff Cleaning”

Naveen Ravindran, Application Engineer, Zestron

4:35 - Break & Networking

4:45 - "Constraint Driven HDI PCB Design"

Weldon Tadlock, CID+, Cadence Design Systems

(Sponsored by the IPC Designers Council Austin Heart of Texas (AHOT) Chapter)

5:15 - “ Challenges & Opportunities in Electric Propulsion / Generation Systems”

Julian Partridge, VP, KLD Energy Technologies

5:45 - Closing Remarks

6:00 - Food & Refreshments Served and More Networking

Registration:

RSVP to Bob Baker at: rjbakeratx@austin.rr.com

There is no charge for SMTA, IMAPS, or IPC DC members; $10 for all non-members

Event Location:

National Instruments, Bldg-C Conference Room, 11500 N. MoPac in North Austin

Near SW corner of Duval Road and MoPac

See Map at: (Map to NI)

In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA).

DfR Solutions Supports NSF-funded Energy Research Program with Best Practices in Solar Technology

Greg Caswell will provide a guiding hand on Solar Packaging and Manufacturability.

DfR Solutions, a leader in quality, reliability, and durability (QRD) solutions for the electronics industry, is very proud to announce that Greg Caswell, Senior Member of the Technical Staff, has been nominated to the Advisory Board of the National Science Foundation (NSF) funded Vertically Integrated Center for Transformative Energy Research (VICTER), a multi-campus center consisting of the University of Arkansas, University of Arkansas at Little Rock (UALR), Arkansas State University, and University of Arkansas Pine Bluff.

Greg Caswell has been a leading figure in electronics packaging and manufacturing for over 25 years, from being the primary author of the first book on manufacturing of surface mount electronics to his more recent role as President of the International Microelectronics and Packaging Society (IMAPS).

“It is a distinct pleasure to support the students and faculty as they develop their implementation strategies and further the leading edge of solar energy,” said Mr. Caswell. “There are a number of synergies between traditional electronics and newer technologies, such as solar and light emitting diodes (LEDs), that will allow me to use my background in electronic packaging, particularly from a reliability perspective, to help provide insight into their advanced development activities. I look forward to working with such a talented group of individuals.”

“Mr. Caswell is a packaging expert and a long acquaintance of mine through IMAPS,” explained Professor Ajay Malshe, the Executive Director of Materials and Manufacturing Research Laboratories and coordinator of VICTER’s research activities at the University of Arkansas.” VICTER is honored to welcome Greg Caswell as a member of our advisory board who will bring an industrial perspective to this strategic area for success of the center, as packaging of solar devices connects the sun to a reliable energy grid. His extensive experience in electronics packaging will make him a valuable asset to our mission.” “Mr. Caswell and our entire External Advisory Board serve an invaluable role for our center in that they have a broad perspective on the field and can help ensure that VICTER’s research efforts are relevant and focused and that we are aware of other opportunities for collaborations and partnering,” said Alan Mantooth, VICTER’s Executive Director.

Learn How to Design for Thermal Cycling!

SAVE THE DATE: May 24, 2011 12-1pm EDT and 8-9pm EDT Learn How to Design for Thermal Cycling. Attend this informative webinar presented jointly by IMAPS and DfR Solutions, a leading provider of quality, reliability, and durability research and services for the electronics industry. Modern electronic design is highly complex. Changes in temperatures, thermal cycling, will eventually cause materials joined together to pull apart. Good design will delay this event as long as possible. In this webinar, Dr. Nathan Blattau will: • Review the fundamental drivers for thermo-mechanical fatigue • Using Physics of Failure, relate drivers to predictive algorithms • Demonstrate how to develop more robust designs against thermal cycling environments Don’t miss out! Early Bird Registration here. Click here to view the newest webcast on Sherlock - the innovative Automated Design Analysis tool that will help you predict the future.