Central Texas Electronics Association
Electronics Design & Manufacturing Symposium
Tuesday, February 21, 2012
Freescale Bldg A Conference Center at 7700 W. Parmer Lane
Program:
3:00 - Registration Begins
3:30 - Welcome and Introductions
3:35 - "Comparing Electronic Component Package Materials and Substrate Vendors for
Solder-Joint Reliability Improvements," Joah Rayos, Packaging Engineer, Freescale
4:05 - "Challenges With Package on Package (PoP) Technology"
Greg Caswell, Senior Member of Technical Staff, DfR Solutions
4:35 - Break & Networking
4:45 - "Next Generation Cyber Threats”
John Pirc, Senior Product Line Manager, HP-TippingPoint
5:15 - "Introduction to DSP with the ARM Cortex-M4 Microcontroller"
Sergio Liberman, Senior Microcontroller Systems Engineer, Freescale
5:45 - Closing Remarks
6:00 - Food & Refreshments Served and More Networking
Registration:
RSVP to Bob Baker at: rjbakeratx@austin.rr.com
There is no charge for SMTA and IMAPS members; $10 for all non-members
Event Location:
Freescale Semiconductor Bldg A Conference Center at 7700 West Parmer Lane, Austin, Texas
See Map at: (Map to Freescale)
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