Showing posts with label SMTA. Show all posts
Showing posts with label SMTA. Show all posts

Wednesday, March 28, 2012

CTEA Electronics Design & Manufacturing Symposium

Central Texas Electronics Association (Joint Chapter of IMAPS & SMTA Members) Presents:

Electronics Design & Manufacturing Symposium

Tuesday, April 17, 2012

Virtex Assembly at 12234 N. I-35 & W. Yager Lane, Bldg A

Program:

2:00 - Registration Begins

2:30 - Welcome and Virtex Assembly Factory Overview

2:35 - Virtex Assembly Factory Tours

3:35 - "Conflict Minerals Legislation and its impact on Electronic Manufacturing”

Brad Heath, President, Virtex Assembly

4:05 - "Evolving Counterfeit Component Threats and Industry Mitigation Efforts"

Stephen Schoppe, President, Process Sciences Inc (PSI)

4:35 - Break & Networking

4:50 - "Factors for a Green Cleaning Process”

Ram Wissel, Technology Manager, Kyzen

5:20 - "Green Trends and Innovations in the Electronics Industry"

Albert Tsang, Environmental Affairs, Dell

5:50 - Closing Remarks

6:00 - Food & Refreshments Served and More Networking

Registration:

RSVP to Bob Baker at: rjbakeratx@austin.rr.com

There is no charge for SMTA and IMAPS members; $10 for all non-members

Event Location:

Virtex Assembly at 12234 North I-35 & W. Yager Lane, Bldg A, Austin, Texas

See Map at: (Map to Virtex)

Save the Date: Another CTEA Symposium is scheduled for 6/13 at Cerium Labs

Friday, March 23, 2012

SMTA Webtorial on Pad Cratering on April 12 & 19

Cheryl Tulkoff will be presenting "Pad Cratering and Pb-Free" during these webinars. For more information or to register, please visit the SMTA website.

SMTA Webtorial: Pad Cratering

Two (2) 90 minute Sessions
Thursday, April 12 and 19, 2012
1:00pm to 2:30pm Eastern
Presented by: Cheryl Tulkoff, DfR Solutions

What You Will Learn:
Pad cratering is defined as cracking which initiates within the laminate during a dynamic mechanical event such as In Circuit Testing (ICT), board depanelization, connector insertion, and other shock and vibration inducing activities. During this webtorial, you'll learn the key drivers, measurement and detection protocols, and preventive tactics for this serious but prevalent failure. Pad cratering was first recognized in BGA packages but newer leadless, bottom termination components are also vulnerable.

Topics Covered:
  • Pad Cratering Defined
  • Is Pad Cratering a Pb-free issue?
  • At risk components
  • Drivers
  • Finer pitch components
  • More brittle laminates
  • Stiffer solders (SAC vs. SnPb)
  • Presence of a large heat sink
  • Detection and Failure Analysis Procedures: Which ones are effective & why
  • X-ray
  • Dye-n-pry
  • Ball shear
  • Ball pull
  • Mitigation Practices & Solutions to Pad Cratering
  • Board Redesign
  • Solder mask defined vs. non-solder mask defined
  • Limitations on board flexure
  • 750 to 500 microstrain, Component dependent
  • Specification and Procedure Discussion
  • Strain Gage Testing Protocols
  • ICT Fixture Evaluation
  • Assembly Process Evaluation
  • Process Specifications
  • More compliant solder
  • SAC305 is relatively rigid, SAC105 and SNC are possible alternatives
  • New acceptance criteria for laminate materials
  • Intel-led industry effort
  • Attempting to characterize laminate material using high-speed ball pull and shear testing, Results inconclusive to-date
  • Alternative approaches
  • Targeted Audience:
    Design, Manufacturing, and Failure Analysis Engineering

    Instructor Bio:
    Cheryl Tulkoff is an industry renowned expert in the fields of semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. Prior to joining DfR, Ms. Tulkoff had an active leadership role both within her employer's companies and among regional and national electronics and reliability organizations. At her most recent position at National Instruments, Cheryl developed a comprehensive reliability organization, including the creation of an internal failure analysis group and a closed loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication through her work at Cypress Semiconductor in electronics assembly, and through her work at IBM. Cheryl is the head of DfR's office located in Austin, Texas, which opened in February 2009. B.S., Mechanical Engineering (Georgia Institute of Technology)



    Sunday, March 11, 2012

    DfR Solutions at Solar Manufacturing & Reliability Web-Conference March 22-23, 2012

    Solar Manufacturing and Reliability Web-Conference

    March 22-23, 2012

    http://www.smta.org/solar/tech.cfm

    SMTA and SEMA have announced the finalized program of the Solar Manufacturing and Reliability Web-Conference taking place March 22-23, 2012. The program will consist of presentations and discussion covering the reliability testing of PV Modules covering gaps and where future work needs to be done. It will highlight various reliability programs being done in the industry with an assessment of current and evolving standards in manufacturing and reliability. This will include the work of the PV QA Forum Task Force groups who will submit their recommendations to the various IEC and other international standard groups.

    Technical Sessions

    Sessions will cover inverter and microinverter reliability / Balance of Systems and future trends. Module manufacturing and general manufacturing issues will be discussed together with a review of the global solar outlook. Areas of concerns will be discussed for modules which include General module hazardous issues and module warranties.

    The web-conference is supported by IPVEA.



    Friday, February 10, 2012

    DfR Solutions' Greg Caswell presents at Central Texas Electronics Association in Austin, TX: Feb 21

    Greg Caswell will be making a presentation on "Challenges with Package on Package (PoP)" at this local chapter meeting of IMAPS/SMTA and IPC members. For more information contact Greg Caswell.

    Central Texas Electronics Association
     
    Electronics Design & Manufacturing Symposium 
    Tuesday, February 21, 2012
    Freescale Bldg A Conference Center at 7700 W. Parmer Lane

    Program:

    3:00 - Registration Begins

    3:30 - Welcome and Introductions

    3:35 - "Comparing Electronic Component Package Materials and Substrate Vendors for

    Solder-Joint Reliability Improvements," Joah Rayos, Packaging Engineer, Freescale

    4:05 - "Challenges With Package on Package (PoP) Technology"

    Greg Caswell, Senior Member of Technical Staff, DfR Solutions

    4:35 - Break & Networking

    4:45 - "Next Generation Cyber Threats”

    John Pirc, Senior Product Line Manager, HP-TippingPoint

    5:15 - "Introduction to DSP with the ARM Cortex-M4 Microcontroller"

    Sergio Liberman, Senior Microcontroller Systems Engineer, Freescale

    5:45 - Closing Remarks

    6:00 - Food & Refreshments Served and More Networking

    Registration:

    RSVP to Bob Baker at: rjbakeratx@austin.rr.com

    There is no charge for SMTA and IMAPS members; $10 for all non-members

    Event Location:

    Freescale Semiconductor Bldg A Conference Center at 7700 West Parmer Lane, Austin, Texas

    See Map at: (Map to Freescale)

    Tuesday, January 10, 2012

    DfR Solutions at 2012 SMTA Houston Expo


    Please join us for our 2012 Houston SMTA Expo & Tech Forum at the Stafford Centre, 10505 Cash Road, Stafford, Texas 77477. Come see what the industry has to offer in new products and services with over 60 tabletop exhibitors. The Expo will be held in Ballroom A through C and the Tech Forum will be held in Room 104 and 105. Free lunch catered by the Black Eyed Pea.


    We are pleased to offer an outstanding technical program this year:

    11 AM Flex Circuit Design for Reliability

    Speaker: Steve Kelly, PFC Flexible Circuits Limited

    Abstract: The design of flexible circuits presents a challenge to those who are primarily familiar with rigid boards. This presentation discusses the construction of six basic types of flex and rigid flex circuits and the properties of the materials that they are made from. Flex circuits have special layout rules due to the fact that they will be bent in the application, and because the material properties create unique challenges in assembly. The major differences between flex and rigid board layouts will be discussed, as well as a short primer on design for impedance control in flex circuits.

    Speaker: Steve Kelly is the President and founder of PFC Flexible Circuits Limited in Toronto, Ontario. He has been involved in the design and manufacture of flex and rigid flex circuits for 28 years. Steve holds a Bachelor’s degree from McMaster University and an MBA from the University of Western Ontario.

    Abstract: A long-time need for high temperature solders has existed in many industries including industrial controls, aerospace, and oil exploration. Basic material requirements have typically been ease of assembly, resistance to creep, low cost, and more recently Pb-free. Now may be the perfect time to rethink some of these past approaches. This presentation will review traditional approaches and some variations, then expand into some of the many alternative methodologies that are in recent use as well as those under development or being evaluated.

    Speaker: Cheryl Tulkoff is an industry renowned expert in the fields of semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. At her most recent position at National Instruments, Cheryl developed a comprehensive reliability organization, including the creation of an internal failure analysis group and a closed loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication through her work at Cypress Semiconductor in electronics assembly, and through her work at IBM. Cheryl is the head of DfR’s newest office located in Austin, Texas, which opened in February 2009.



    Abstract: Over the past few years, the test philosophy has changed from ICT (in-circuit testing) to flying probe testing due to the cost of fixturing and required engineering resources. This presentation will review the history of automated test systems, how far technology has advanced the capabilities of flying probe testing and how to develop a test strategy to ensure best overall test coverage and throughput.

    Speaker: John Oaf is Applications Manager for the Takaya Group at Texmac, Inc. He has over 24 years experience in production testing at GenRad, Inc. and Teradyne, Inc.

    FREE LUNCH and LOTS OF DOOR PRIZES


    2012 Show Schedule

    10 a.m. Expo open to attendees

    11:00 a.m.-11:45 a.m. Technical Presentation

    Topic: Flex Circuit Design for Reliability

    Speaker: Steve Kelly, PFC Flexible Circuits

    11:45 a.m. Door prize drawing

    12:15 p.m. - 12:45 p.m. – Free Lunch

    12:45 p.m. - 1:00 p.m. - Random Drawings for Gift Certificates and Special Mid-Day Prize

    (must be present to win)

    1:00 p.m. - 1:45 p.m. Technical Presentation

    Topic : Advances & Challenges in High Temperature Component Attachment

    Speaker: Cheryl Tulkoff, DfR Solutions, LLC

    1:45 p.m. Door prize drawing

    2:00pm-2:45pm Technical Presentation

    Topic: How Flying Probers Optimize Test Strategy

    Speaker: John Oaf, TEXMAC Inc.

    2:45 p.m. Door prize drawing

    3:00 p.m. - 3:15 p.m. - Random Drawings for Gift Certificates and Special Afternoon Prize (must be present to win) 3:15 p.m. - 3:30 p.m. - Drawings for Bingo Prize (need not be present to win)

    Drawing for Free Booth for 2013 (exhibitors only) 3:00 p.m. - 5:00 p.m. - Networking Reception - Beverages and Snacks - no charge

    We look forward to seeing you at the Expo on February 9! Please register on-line or call the SMTA at (952)920-7682. For exhibitors, we have extended the early-bird rate until January 31.