Friday, March 16, 2012
DfR Solutions' Sherlock Helps Eliminate Pad Cratering
Thursday, January 5, 2012
DfR's Cheryl Tulkoff to present IPC APEX Professional Development Course on DFM
Cheryl Tulkoff, Senior Member tech staff, DfR Solutions
What You Will Learn
- Printed boards and process material selection
- Plated-through hole design
- Conductor width and spacing
- Keep-out zones
- Copper balancing
- Microvias, via fill technologies
- Multiple lamination
- Equipment process controls and reliability testing
- Matching PCB complexity to supplier capabilities
- Partnering and off-shore strategies
- Importance of supplier report cards to monitor quality and reliability
- Cover circuit card assemble
- Pad geometries, component spacing and location
- Heat sink selection
- Standoffs and wiring
- Influences of PCB thickness, cut-outs, and depanelization techniques on reliability
- Comparison of surface mount, wave and hand soldering
- Moisture Sensitivity Level handling, process optimization and control strategies, repair and rework.
Tuesday, October 25, 2011
IPC Designers Council Webinar in Huntsville, AL on October 26
Sunday, July 17, 2011
IPC Summer School Webinar: DFM, Design for Manufacturing
DFM-Design for Manufacturing
Cheryl Tulkoff, DfR Solutions
Wednesday, August 3
10:00 am–11:00 am CT
Design for manufacturability (DFM) best practices ensure that manufacturing capability is taken into consideration during the design and layout of a product. By understanding the potential effects of — and how to avoid — overtaxing their manufacturer, engineers can be confident in the execution of their design. Attendees will come away with a greater comprehension of the potential manufacturability hazards to avoid during the design process, and an understanding of the benefits of DFM.
What You Will Learn
- Printed board design and process material selection
- Equipment process controls and reliability testing
- Matching pcb complexity to supplier capabilities
- Influences of PCB thickness, cut-outs, and depanelization techniques on reliability
- M.S.L, handling, process optimization and control strategies, repair and rework
About the Instructor
Cheryl Tulkoff is a senior member of the DfR Solutions staff. Her areas of expertise include semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. Prior to joining DfR, Tulkoff developed a comprehensive reliability organization at National Instruments, including creation of an internal failure analysis group and a closed-loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication in electronics assembly at Cypress Semiconductor and IBM.
Thursday, May 26, 2011
DfR Solutions in Harrisburg, PA: May 31-June 2
Wednesday, March 31, 2010
Design for Excellence (DfX) West is almost here!
Two tracks are available; however, each course is priced individually to allow attendees to register for the specific courses which best fit their individual needs. Feel free to mix-and-match. If you can't attend for the entire week, select the course(s) most valuable to you.
Cost: Two day = $1195, One day = $695, Half day = $395. Webinar costs are 25% less.
Track 1: DfX
Monday: Design for Reliability (1 day)
Tuesday: Design for Environment (1 day)
Wednesday: Design for Manufacturability (1 day)
Thursday: Design for Testability (1 day)
Friday: Software Design for Reliability (1/2 day) and Design for Warranty (1/2 day)
Track 2: ALT/RCA
Monday & Tuesday: Best Accelerated Life Tests (2 days)
Wednesday & Thursday: Root Cause Analysis (2 days)
Friday: Design for Mechanical Reliability (1 day)
Click here to view the Introduction to DfX Concepts webinar from Qualmark's Ask the Experts series. For more information, or to register, please click here or e-mail tsmittenaar@dfrsolutions.com.