DfR Solutions' Sherlock Helps Eliminate Pad Cratering

Tired of breaking components during Bed of Nails In-Circuit Testing (ICT)? DfR's Automated Design Analysis Tool, Sherlock, now provides an elegant solution to this consistent design for manufacturability (DfM) problem. Within a matter of minutes, test points, components, and supports can be arranged and located to minimize board flexure and effectively eliminate pad cratering or solder joint cracking. For more information, contact Tom O'Connor.

Design for Manufacturability for PCBs - IPC Designers Council North Alabama Meeting

Meeting of the North Alabama chapter of the
IPC Designers Council

Date: Wednesday, October 26^th, 2011

Time: 12:00 pm - 1:30 pm
Where: Adtran - South Tower

Topic: Design for Manufacturability for PCBs

Presentation by: Cheryl Tulkoff , Senior Member of the Technical Staff - DfR Solutions

Cheryl Tulkoff has over 22 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs.

Lunch will be provided by Adtran!

No cost to attend.

Reserve a spot on your calendar on Wednesday, October 26^th from 12:00 pm to 1:30pm for this educational meeting being held at Adtran in Huntsville .

Please RSVP no later than noon on Tuesday, October 25^th to Aaron Lesky at alesky@asc-i.com

Agenda:

Lunch served 12:00 - 12:15

Presentation 12:15- 1:15

Wrap Up 1:15 - 1:30

Location:

Adtran North Tower

901 Explorer Blvd

Hunstville, AL 35806

Hope you can attend!

Aaron Lesky

American Standard Circuits

alesky@asc-i.com

310-633-1466

EIPC and DfR are Hosting 2 Reliability Workshops in the UK

EIPC and DfR are hosting 2 workshops in the UK:

Monday October 17, 2011
-Workshop on Design for Manufacturing (English language)

Tuesday October 18, 2011
-Workshop on Next Generation Technologies in Electronic
Packaging and Production (English language)

Location: Enthone Ltd., Woking, Surrey, UK

Please click

Here for a detailed program of both workshops

Please click here to download the Registration form

Who should attend?

Design Personnel, Product Personnel, Reliability Personnel and Executives responsible for insertion of new technologies.

If you need more information please contact the EIPC: Kirsten Smit-Westenberg at kwestenberg@eipc.org or call +31-43-3440872

DfR Solutions to Provide Manufacturing and Reliability Thought Leadership to DoD Systems Engineering

In recognition of its extensive expertise and experience and ability to develop and introduce new concepts into systems development, DfR Solutions has been selected to support the Office of theSecretary of Defense (OSD) in the areas of manufacturability, reliability, maintainability, and sustainability. Specifically, DfR's integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. For more information, please click here or contact Walt Tomczykowski, wtomczykowski@dfrsolutions.com.

Lead-Free Reliability Workshop: Oct. 31st in Irvine, CA

IPC Conference on Reliability:
ASSEMBLY PROCESS for a RELIABLE PRODUCT

LEAD-FREE RELIABILITY WORKSHOP: October 31, 2011

CONFERENCE: November 1–2, 2011 • Irvine, Calif.

This unique event will take you through the assembly process — from materials to test and inspection — and provide you with the latest information so you can increase your reliability.

LEAD-FREE RELIABILITY WORKSHOP

October 31
10:00 am to 5:00 pm
Design for Reliability in the Lead-Free Era

Instructor: Cheryl Tulkoff, Senior Member of Technical Staff, DfR

This workshop provides a focused but comprehensive discussion of all issues that can arise during the transition to lead free. All areas of potential risk will be examined, including:
• popcorning
• tin whiskers
• plating failures associated with various solder materials
• plated-through hole (PTH) barrel cracking
• pad cratering
• thermomechanical wearout
• high-cycle fatigue

For each reliability concern, the latest research will be shared and you will learn the best ways to mitigate risk based on a product's design, materials, complexity, volumes and customer expectations of reliability. A final summary will provide you with a roadmap for ensuring the reliability of your lead-free product.

Who Should Attend?
This course is designed for engineers and manufacturing personnel who need to fully comprehend the characteristics of design for reliability (DFR) and how it applies to unique applications.

Register Now!

IPC Summer School Webinar: DFM, Design for Manufacturing

DFM-Design for Manufacturing
Cheryl Tulkoff, DfR Solutions
Wednesday, August 3
10:00 am–11:00 am CT

Sign up here!

Design for manufacturability (DFM) best practices ensure that manufacturing capability is taken into consideration during the design and layout of a product. By understanding the potential effects of — and how to avoid — overtaxing their manufacturer, engineers can be confident in the execution of their design. Attendees will come away with a greater comprehension of the potential manufacturability hazards to avoid during the design process, and an understanding of the benefits of DFM.

What You Will Learn

• Printed board design and process material selection
• Equipment process controls and reliability testing
• Matching pcb complexity to supplier capabilities
• Influences of PCB thickness, cut-outs, and depanelization techniques on reliability
• M.S.L, handling, process optimization and control strategies, repair and rework

About the Instructor

Cheryl Tulkoff is a senior member of the DfR Solutions staff. Her areas of expertise include semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. Prior to joining DfR, Tulkoff developed a comprehensive reliability organization at National Instruments, including creation of an internal failure analysis group and a closed-loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication in electronics assembly at Cypress Semiconductor and IBM.

Package on Package: DfM / DfR, Part 1

After years of incubating inside short-life, high-volume consumer products, package-on-package (PoP) is ready to make the leap to mainstream products. Just like QFNs , this new part type can bring on manufacturability and reliability challenges. For more information on solutions to these challenges, please contact Cheryl Tulkoff, ctulkoff@dfrsolutions.com.

Manufacturability & Reliability Challenges with QFN: Mar. 10 ASQ RS Webinar

ASQ Reliability Society Webinar Series

Thursday March 10, 2011 noon-1:00 pm EDT

DESCRIPTION: The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.

PRESENTER: Cheryl Tulkoff has over 15 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs.

Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a published author, experienced public speaker and trainer and a Senior member of both ASQ and IEEE. She holds leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections. She chaired the annual IEEE ASTR workshop for four years and is also an ASQ Certified Reliability Engineer.

She has a strong passion for pre-college STEM (Science, Technology, Engineering, and Math) outreach and volunteers with several organizations that specialize in encouraging pre-college students to pursue careers in these fields.

To Register click here

DfR in Boston, MA the week of July 12th

Cheryl Tulkoff, CRE, Senior Member of Technical Staff and Manager of the Austin Office at DfR Solutions, will be in Boston, MA, the week of July 12, 2010.

While Cheryl is in the Boston area, she will be available to visit interested companies to make presentations on a variety of topics including assembly processes, design for manufacturability and Pb-free, component engineering and our brand new Automated Design Analysis Software.

She would be more than happy to include your company in her visit. If you are interested in arranging a complimentary onsite presentation, please contact Tammy Smittenaar, DfR's Business Manager, tsmittenaar@dfrsolutions.com

Design for Excellence (DfX) South

Did you miss attending Design for Excellence (DfX) West? Don't worry, DfX South is right around the corner. Register today!

The five-day seminar will be held in Huntsville, Alabama, on May 17-21, 2010. Courses will also be available via live webinar for those out of the area. This one-of-a-kind collaborative effort will provide designers, reliability personnel, and engineering management with tools on how to meet time-to-market deadlines and reduce warranty issues.

Two tracks are available; however, each course is priced individually to allow attendees to register for the specific courses which best fit their individual needs. Feel free to mix-and-match. If you can't attend for the entire week, select the course(s) most valuable to you.

Cost per course, per person: two day = $1195, one day = $695. Webinar costs are 25% less. Register five people and the fifth person is FREE! Discounts for full-time students and unemployed individuals are available.

Track 1: DfX
Monday: Design for Reliability (1 day)
Tuesday: Design for Environment (1 day)
Wednesday: Design for Manufacturability (1 day)
Thursday: Design for Testability (1 day)
Friday: Design for Components (1 day)

Track 2: ALT/RCA
Monday & Tuesday: Best Accelerated Life Tests (2 days)
Wednesday & Thursday: Root Cause Analysis (2 days)
Friday: Design for Mechanical Reliability (1 day)

For more information, or to register, please click here or e-mail accounting@dfrsolutions.com

DfX Seminar - San Jose, California

DfR Solutions, in association with Ops a La Carte and Value Engrafting, is proud to announce that the Design for Excellence training session is back!

There was such a high demand for the DfX course in Maryland in October 2009 that we are holding an expanded seminar in San Jose, California, April 19-23, 2010. This one-of-a-kind collaborative effort will provide designers, reliability personnel, and engineering management with tools on how to meet time-to-market deadlines and reduce warranty issues.

Two tracks are available. Attendees may elect to register for an entire track or pick and choose the specific courses which best fit their individual needs.

Track 1: DfX
Monday: Design for Reliability
Tuesday: Design for Environment
Wednesday: Design for Manufacturability
Thursday: Design for Testability
Friday: Software Design for Reliability and Design for Warranty

Track 2: ALT/RCA
Monday & Tuesday: Best Accelerated Life Tests
Wednesday & Thursday: Root Cause Analysis
Friday: Design for Mechanical Reliability

All courses will be available both in the classroom and via webinar. We are also offering a Group Discount: Every 5th registrant from the same company registering together is FREE!

For more information, or to register, please click here or send an e-mail to tsmittenaar@dfrsolutions.com.