DfR Solutions' Sherlock Helps Eliminate Pad Cratering

Tired of breaking components during Bed of Nails In-Circuit Testing (ICT)? DfR's Automated Design Analysis Tool, Sherlock, now provides an elegant solution to this consistent design for manufacturability (DfM) problem. Within a matter of minutes, test points, components, and supports can be arranged and located to minimize board flexure and effectively eliminate pad cratering or solder joint cracking. For more information, contact Tom O'Connor.