Manufacturability and Reliability of 0.3mm Pitch Chip Scale Packages

SAVE THE DATE: Tuesday, December 6, 2011, 11am EDT

As parts get smaller and smaller and the pitch between contacts gets closer and closer, assuring reliability during manufacturing becomes more and more difficult.

To successfully move to 0.3mm pitch requires buy-in from the entire manufacturing industry, from the printed board manufacturer, to the solder paste supplier, to the stencil manufacturer, and a comprehensive understanding of the potential reliability risks that the change in interconnect design may entail.

Attend this informative webinar presented jointly by ITM Consulting and DfR Solutions, a leading provider of quality, reliability, and durability research and services for the electronics industry, and learn about this issue from the perspective of the manufacturing and reliability.

Don't miss out! Early Bird Registration here.

To learn more about DfR Solutions, click here.

Shock Webtorial in Conjunction with Qualmark: Thursday, November 17)

Dr. Nathan Blattau, DfR's Chief Technologist, will be the featured presenter for a special 2-part edition of Qualmark's popular Ask the Experts webinar series this fall. Mark your calendars to attend the October 20th session on Vibration and the November 17th session on Shock when Dr. Blattau will discuss the effects of these stresses and how they can be effectively applied during product development and process verification to deliver a more reliable product. Registration is now open.

IPC Designers Council Webinar in Huntsville, AL on October 26

Cheryl Tulkoff will be presenting a webinar on "DFM for PCB." The meeting will be a "lunch and learn" webinar at the AdTran facility in Huntsville and will be conducted by the IPC Designers council. For more information contact Cheryl Tulkoff.

How to Accelerate Automotive Product Development: Webinar on June 30)

Jim McLeish will present a webinar entitled "How to Accelerate Automotive Product Development." Registration is now open. For more information, contact Jim McLeish,jmcleish@dfrsolutions.com.

How to Design for Thermal Cycling: Upcoming iMAPS Webinar

In collaboration with iMAPS, DfR Solutions will present a broad-based webinar on the challenges of designing for an environment with changing temperature. Whether your product is military, industrial, or part of the 'Free Air Cooling' trend, this insightful presentation will identify all of the mechanisms affiliated with thermal cycling and how to rapidly assess these risks during product design. To register, please contact Brian Schieman, bschieman@imaps.org. For more information, contact Nathan Blattau, nblattau@dfrsolutions.com.