Showing posts with label PCB. Show all posts
Showing posts with label PCB. Show all posts

Tuesday, April 17, 2012

SMT Hybrid Packaging 2012 Conference - Nuremberg, Germany May 8 - May 10

I'll be attending and teaching at SMT Hybrid Packaging 2012 in Nuremberg, Germany May 8-May 10.

On Thursday, May 10th, I'll teach Tutorial 16 on:

Design for Reliability and Sourcing of Printed Circuit Boards

Schedule

Thursday, 10.05.2012, 09:00 - 12:00 hrs

Speaker

Cheryl Tulkoff, DfR Solutions, College Park, USA

Language

English

Description

In the electronics industry, the quality and reliability of any product is highly dependent upon the capability of the manufacturing supplier, regardless of whether it is a contractor or a captured shop. Manufacturing issues are one of the top reasons that companies fail to meet warranty expectations, which can result in severe financial pain and eventual loss of market share. What a surprising number of engineers and managers fail to realize is that focusing on processes addresses only part of the issue. Design plays a critical role in the success or failure of manufacturing and assembly. Designing printed boards today is more difficult than ever before because of the increased lead free process temperature requirements and associated changes required in manufacturing. Not only has the density of the electronic assembly increased, but many changes are taking place throughout the entire supply chain regarding the use of hazardous materials and the requirements for recycling. Much of the change is due to the European Union (EU) Directives regarding these issues. The RoHS and REACH directives have caused many suppliers to the industry to rethink their materials and processes. Thus, everyone designing or producing electronics has been or will be affected.

Target group: Managers & Engineers representing the PCB Design, Manufacturing, Process Planning and Development and Failure Analysis functions.

To learn more about the conference, click here.

To register, click here.

For the conference flyer, click here.

Tuesday, October 25, 2011

IPC Designers Council Webinar in Huntsville, AL on October 26

Cheryl Tulkoff will be presenting a webinar on "DFM for PCB." The meeting will be a "lunch and learn" webinar at the AdTran facility in Huntsville and will be conducted by the IPC Designers council. For more information contact Cheryl Tulkoff.

Friday, October 21, 2011

Design for Manufacturability for PCBs - IPC Designers Council North Alabama Meeting

Meeting of the North Alabama chapter of the
IPC Designers Council

Date: Wednesday, October 26th, 2011

Time: 12:00 pm - 1:30 pm
Where: Adtran - South Tower

Topic: Design for Manufacturability for PCBs

Presentation by: Cheryl Tulkoff , Senior Member of the Technical Staff - DfR Solutions

Cheryl Tulkoff has over 22 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs.

Lunch will be provided by Adtran!

No cost to attend.

Reserve a spot on your calendar on Wednesday, October 26th from 12:00 pm to 1:30pm for this educational meeting being held at Adtran in Huntsville .

Please RSVP no later than noon on Tuesday, October 25th to Aaron Lesky at
alesky@asc-i.com

Agenda:

Lunch served 12:00 - 12:15

Presentation 12:15- 1:15

Wrap Up 1:15 - 1:30

Location:

Adtran North Tower

901 Explorer Blvd

Hunstville, AL 35806

Hope you can attend!

Aaron Lesky

American Standard Circuits

alesky@asc-i.com

310-633-1466

Tuesday, July 26, 2011

IPC AHOT (Austin) Design Council Meeting on August 9th at 6 PM

The Science of PCB Stackups

Susy Webb - Sr. PCB Designer at Fairfield Industries

How current flows through a stack and why the stackup is SO important for the board to work properly.

This is a half day presentation squeezed into 2 hrs for our chapter meeting with lots of good information! Susy has done a lot of research and will be presenting this at the IPC Design Conference, PCB West, in September.

Presenter Bio: Susy Webb is a senior PCB designer with 32 years of experience. Her career includes experience in a variety of fields, including point-to-point microwave network systems, oceanographic oil exploration
equipment, and CPCI and ATX computer motherboards. She has set up company standards, documentation, procedures, and library conventions for several companies. Susy is a regular speaker at the PCB and IPC conferences and has made presentations internationally as well, discussing practical implementation of engineering concepts into board layout, and methods to improve the overall design and flow of printed circuit boards. She is CID certified and has been a writer/columnist for Printed Circuit Design and Fab magazine. She is an active member of the IPC Designer's Council Executive Board at the international level and a member of its education committee. She is also a past president of the Houston (Tx) Chapter of the Designer's Council. We are pleased to offer her presentation to AHOT Members!

Location: Cadence Design Systems, Inc.
RSVP to Linda at 512-259-2465,
12515-7 Research Boulevard, Ste 250

<mailto:linda@kutzsales.com> linda@kutzsales.com