May 3-6, 2011
Crowne Plaza Toronto Airport Hotel
Toronto, Ontario, Canada
Crowne Plaza Toronto Airport Hotel
Toronto, Ontario, Canada
The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio-medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies. In addition, the European Union’s RoHS directive has now been joined by those of REACH, the dimethyl fumarate ban and the new Canadian Management plan on substances of concern for electrical and electronic equipment complicating matters considerably. The use of tailored alloy systems, the variety of alloy choices, and smaller passive component assembly are among the concerns being addressed. Soldering and reliability engineers and designers need to come together to share their knowledge and their vision for addressing these challenges.
PROGRAM OUTLINE
SMTA Lead-Free Academy
Tuesday May 3, 2011
Click on the tutorial titles below to view the full descriptions.
Tuesday, May 3
T1: 2nd Generation Lead Free Alloys: Is SAC the Best We Can Do?
Cheryl Tulkoff, DfR Solutions: 8:30a.m. – 12:00p.m.
T2: Solder Joint Reliability—Failure Mode and Root Cause Analyses (Fatigue, Brittle Fracture, ENIG)"
Werner Engelmaier,Engelmaier Associates, L.C.: 8:30a.m. - 12:00p.m.
Tuesday, May 3
T3: High Reliability: Solving Problems with Reliability in the Lead-Free Era
Cheryl Tulkoff, DfR Solutions: 1:30p.m. – 5:00p.m.
T4: Solder Joint Reliability—Acceleration Models, Accelerated Reliability Tests and Screening Procedures
Werner Engelmaier,Engelmaier Associates: 1:30p.m. – 5:00p.m.
Registration
SMTA Lead-Free Academy
Tuesday May 3, 2011
Click on the tutorial titles below to view the full descriptions.
Tuesday, May 3
T1: 2nd Generation Lead Free Alloys: Is SAC the Best We Can Do?
Cheryl Tulkoff, DfR Solutions: 8:30a.m. – 12:00p.m.
T2: Solder Joint Reliability—Failure Mode and Root Cause Analyses (Fatigue, Brittle Fracture, ENIG)"
Werner Engelmaier,Engelmaier Associates, L.C.: 8:30a.m. - 12:00p.m.
Tuesday, May 3
T3: High Reliability: Solving Problems with Reliability in the Lead-Free Era
Cheryl Tulkoff, DfR Solutions: 1:30p.m. – 5:00p.m.
T4: Solder Joint Reliability—Acceleration Models, Accelerated Reliability Tests and Screening Procedures
Werner Engelmaier,Engelmaier Associates: 1:30p.m. – 5:00p.m.
Conference Schedule Wednesday, May 4, 2011 Hours: 8:50a.m. - 6:00p.m. Thursday, May 5, 2011 Hours: 8:50a.m. - 5:30p.m. Friday, May 6, 2011 Hours: 8:40a.m. - 12:00p.m. | The 2011 ICSR speakers include: |
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