DfR Solutions in Europe (France, Finland, Sweden, England, Austria, Switzerland: April 11-18)

Responding to overwhelming demand, Craig Hillman will be visiting several companies in Europe to discuss a variety of topics, including QFNs, Pb-free, design for reliability, copper interconnects in component packaging, and wearout of integrated circuits. If you and your associates are interested in an onsite visit and/or presentation on a these topics or others, please contact June Caswell, jcaswell@dfrsolutions.com, as soon as possible.