DfR Solutions' Walt Tomczykowski at Airworthiness Conference (Baltimore, MD: April 2)

Walt Tomczykowski will be presenting Using Physics of Failure Based Software to Predict Remaining Avionics PCBA Life. In addition, Walt and Tom O'Connor will be manning the DfR booth in the exhibit area. Be sure to stop by and visit with them. For more information contact Walt Tomczykowski.

Do You Have The Knack?

Have you ever felt a strong need to repair your neighbor's washing machine? Or add Wi-Fi to your toaster? Do you have nine computers in various states of assembly on your living room floor? If the answer is yes to any of these questions, you just might have the KNACK. While not curable, the KNACK could lead to a rewarding career in engineering. Just ask our most recent hire, electrical/mechanical/software engineering guru, Justin Wilkins.

Physics of Failure

How important is Physics of Failure (PoF)? Important enough for over eight hundred (8-0-0!) people to view Jim McLeish's recent joint webinar with the American Society of Quality (ASQ) on PoF Reliability Methods. If you missed the opportunity to learn about this ground-breaking approach to design assurance, you can still download the entire presentation. For more information, contact Jim McLeish.

How Hot is Too Hot?

While thermal analysis tools have improved their ability to predict component temperatures, they have failed to answer the most important question: How Hot is Too Hot? In this informative article (warning: ad before article), DfR Solutions explains how classic derating is insufficient and true understanding of component degradation is necessary to optimize product design and performance. For more information, contact Greg Caswell.

DfR Solutions' Sherlock Helps Eliminate Pad Cratering

Tired of breaking components during Bed of Nails In-Circuit Testing (ICT)? DfR's Automated Design Analysis Tool, Sherlock, now provides an elegant solution to this consistent design for manufacturability (DfM) problem. Within a matter of minutes, test points, components, and supports can be arranged and located to minimize board flexure and effectively eliminate pad cratering or solder joint cracking. For more information, contact Tom O'Connor.

DfR Solutions' Craig Hillman authors Package on Package Article

PoP packaging is quickly evolving into one of the next generation packaging technologies due to the increased need to miniaturize electronics. To get a flavor for the issues associated with the manufacturability of assemblies utilizing these packages, read DfR's recent article published in the SMT February 2012 issue. For more information, contact Craig Hillman.

DfR Solutions' Walt Tomczykowski presented "An Introduction to Physics of Failure- Delivering Reliable Products" at the RAMS Conference

Walt Tomczykowski presented "An Introduction to Physics of Failure- Delivering Reliable Products" at the recent RAMS Conference in Reno, NV. The PoF science based approach presented focused on characterizing the life-cycle usage and environmental stress load profiles of an application and understanding the cause and effect physical processes and mechanisms they produce that cause degradation and failure in materials and components. To learn more, contact Walt Tomczykowski.