DfR at PERM Meeting in Arlington, VA: February 2

Craig Hillman and Joelle Arnold will be making a presentation on the status of DfR's two SBIR programs addressing the reliability of reballed BGAs and the reliability of various Pb-free component packages when subjected to shock and vibration testing. For more information contact Joelle Arnold.

Record Attendance at DfR's "Modeling and Simulation in Electronic Packaging" Course

A packed audience at the 2011 Electronic Packaging and Technologies Conference listened to Craig Hillman provide a comprehensive understanding on how to model and simulate the reliability of the latest semiconductor packaging technologies, including copper wire bonds, through silicon vias (TSV), package on package (PoP), and low glass transition temperature (Tg) underfill. For more information on how DfR is driving modeling and simulation (M&S) to the common engineer, please contact Nathan Blattau.

Walt Tomczykowski Re-Elected Vice Chair of GIDEP Industry Advisory Group

DfR is proud to announce Walt's continued participation of this important industrial organization. Walt's leadership and insight has become critical as industry and government respond to recent Counterfeit Parts Legislation. As stated by Jim Stein, GIDEP Program Manager, "Walt's breadth and depth of knowledge in the subjects of DMSMS and non-conforming materiel results in his perspectives carrying a lot of weight." For more information on DfR's counterfeit activities, please contact Walt.

DfR and ISD Italia Partner on Sherlock

DfR is proud to announce that ISD Italia, a leading supplier of software solutions for the electronics industry, will be supporting Sherlock sales and services in Southern Europe and Mediterranean region. For more information, please contact Stefano Barbati.

Application-Specific Integrated Circuits (ASICs) - The Secret to Good Design (Part 2)

The ASIC design flow is a complex process with many important details. First-pass success is desired, but it requires a few iterations to get the information needed to fully meet specifications. DfR can provide support and guidance to help you navigate this process, which is delineated in this white paper. For more information, contact Francisco Tejada.

DfR Solutions asked to give keynote at DSO National Laboratories Reliability Seminar

Craig Hillman was recently invited to give the keynote address at the 2011 Reliability Technical Seminar at Singapore's DSO National Laboratories. In his presentation on "Understanding Commercial Best Practices for Ensuring Quality, Reliability, and Durability," Dr. Hillman detailed how leaders in the commercial electronics marketplace have developed effective and methodical processes for ensuring product by laying a foundation of knowledge, early engagement, quality control, and trust-but-verify techniques. For a copy of the presentation, please contact Ed Dodd.

REACH Moves Forward

The European Chemicals Agency (ECHA) has added twenty (20) more materials to the Candidate List of Substances of Very High Concern (SVHC). While none of the materials tend to be present in electronics, companies must stay abreast of these changes and be aware of their legal obligations. For more information or guidance, please contact Craig Hillman.