Record Attendance at DfR's "Modeling and Simulation in Electronic Packaging" Course

A packed audience at the 2011 Electronic Packaging and Technologies Conference listened to Craig Hillman provide a comprehensive understanding on how to model and simulate the reliability of the latest semiconductor packaging technologies, including copper wire bonds, through silicon vias (TSV), package on package (PoP), and low glass transition temperature (Tg) underfill. For more information on how DfR is driving modeling and simulation (M&S) to the common engineer, please contact Nathan Blattau.