DfR presenting at G12 Meeting in Tempe, AZ February 17th

G12 Meeting in Tempe, AZ: February 16-17

Craig Hillman and Ed Wyrwas will be presenting "Physics of Failure Approach to Integrated Circuit Reliability" at the G12 Solid State Devices Committee Meeting on Thursday, February 17th. For more information, or to arrange to meet with them, please contact Ed Wyrwas.

DfR Solutions in Phoenix, AZ: February 15-17

Craig Hillman will be visiting companies in Phoenix and Tucson, Arizona February 15th through February 17th. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

DfR Welcomes Dr. Gregg Kittlesen as New Senior Member of Technical Staff

DfR Solutions is proud to announce the hiring of Dr. Gregg Kittlesen to lead its component integrity effort. Located at DfR headquarters in College Park, MD, this effort will provide telecommunication and enterprise OEMs insight and guidance into reliability assessment and risk mitigation for components and modules.

Dr. Kittlesen is internationally recognized as an expert in the fields of optoelectronic device and integrated module reliability engineering. Prior to joining DfR Solutions, he was responsible for component and module reliability evaluation at Ciena Corporation, a leading supplier of network infrastructure solutions. His experience included qualification programs, supplier audits, corrective action resolution, failure analysis, reliability prediction, and prognostic health management. Previous positions at Ericsson Microelectronics and Analog Devices included wafer-level testing and qualification of integrated laser/modulator (DFB/EA) devices, chip product engineering, RF bipolar process integration and qualification, etch/deposition tool evaluation and process development.

Upcoming IPC Webinar- High Reliability: Solving Problems with Reliability, Repair and Rework in the Lead-Free Era

High Reliability: Solving Problems with Reliability, Repair and Rework in the Lead-Free Era
Cheryl Tulkoff, DfR Solutions
Wednesday, February 16
10:00 am–11:00 am, Central time
This presentation provides a focused but comprehensive discussion on potential reliability issues that can arise within lead-free processes. All areas of potential risk are examined. For each reliability concern, a brief description is provided, followed by the current state of industry knowledge and an opportunity for risk mitigation based upon the product design, materials, complexity, volumes and customer expectations of reliability. A final summary provides a roadmap for ensuring reliability of lead-free product.

What You Will Learn

SAC — background and alternative alloys PCBs — surface finishes, laminates, PTH barrel cracking and CAF, pad cratering, ECM Components — concerns, moisture and temperature sensitivity Solders — second generation alloys, copper dissolution, mixed assembly Wave and Rework — lead-free solder fountain, hole-fill challenges Reliability — shock/drop test results, SAC vs. SnPb, results of alternative alloys, thermal cycling Fatigue — shock and vibration, microstructural stability, HALT/HASS

About the Instructor
Cheryl Tulkoff has over 15 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no-clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs. Tulkoff earned her Bachelor of Mechanical Engineering degree from Georgia Tech and is an ASQ Certified Reliability Engineer.

Central Texas Electronics Association Symposium - Tuesday, February 22nd

Central Texas Electronics Association

Electronics Design & Manufacturing Symposium 

Tuesday, February 22, 2011

AMD Bldg B500 at 7171 Southwest Parkway

Program:

3:00 - Registration Begins

3:30 - Welcome and Introductions

3:35 - "Lead-Free Chip-Package Interaction Reliability Overview"

Lei Fu, Advanced Micro Devices (AMD)

4:05 - "Improving System Reliability with SynJet Cooling"

Dr. Markus Schwickert, CRE, Nuventix

4:35 - Break & Networking

4:45 - "Counterfeit Components – Avoidance and Detection”

Jason Jowers, Velocity Electronics

5:15 - "AC Power Electronics for Rooftop Solar"

Terence Parker, SolarBridge Technologies

5:45 - Closing Remarks

6:00 - Food & Refreshments Served and More Networking

Registration:

RSVP to Bob Baker at: rjbakeratx@austin.rr.com

There is no charge for SMTA and IMAPS members; $10 for all non-members

Event Location:

AMD Bldg B500 at 7171 Southwest Parkway in South Austin

near Southwest Parkway and West William Cannon Dr (Use Parking Garage P100)

See Map at: (Map to AMD) Or: See attached doc.

In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)

DfR at RAMS in Lake Buena Vista, FL: January 24-27

Greg Caswell will be attending the Annual Reliability and Maintainability Symposium (RAMS) and participating in a panel discussion on Solar Reliability with a focus on Concentrated Photovoltaic system reliability. For more information on these topics contact Greg Caswell.

RAMS Program

Panel 9E Photovoltaic Reliability Room: Nutcracker 3 Wednesday 8:00 AM-10:00 AM

Renewable energy, of which solar energy makes up a large percentage, is believed to be the fastest growing industry sector in the years to come, of which solar energy makes up a large percentage. Despite significant success in the reliability of photovoltaics (PV), reliability and lifetime issues continue to be one of key factors in the rapid commercialization of PV technologies today. This session will give you an overview of current status, challenges and success of PV reliability for different PV technologies, including crystalline silicon PV, thin film PV, concentrated PV, etc.

Moderator: Wendai Wang, Ph.D., Reliability Manager, GreenVolts, Inc., Fremont, CA

Panelists:

John Wohlgemuth, Ph.D., Principle Scientist - PV Reliability, National Renewable Energy Laboratory, Golden, CO Greg Caswell, Sr. Member of the Technical Staff, DfR Solutions, College Park, MD Patrick McCluskey, Ph.D., Associate Professor, Mechanical Engineering, University of Maryland

DfR at PERM in Coral Gables, FL. January 11-13

Jim McLeish will be providing an update on the status of MIL-HDBK-217 at the Pb-Free Electronics Risk Management (PERM) Consortium meeting in Coral Gables, Florida January 11-13, 2011. For more information or to arrange a meeting, please contact Jim McLeish.

The Pb-free Electronics Risk Management Consortium

About PERM
The purpose of the Pb-Free Electronics Risk Management (PERM) Consortium (formerly known as LEAP) is to provide overarching leadership and coordination of Pb-free electronics risk management activities for the government and industry aerospace and defense communities.

The goal of PERM is to better respond to the long term challenges of Pb-free solders and finishes over a systems life cycle.

The PERM Consortium addresses executive leadership, communications, research coordination, standards, training, advocacy, supply chain, and international cooperation through dedicated task teams and advisory groups.

The PERM Consortium is chartered by the Aerospace Industries Association (AIA) and includes support from DoD, DoE, Army, Air Force, Navy, FAA, NASA, and industry.