Craig Hillman at IPC Midwest Conference, Schaumburg, IL: September 21-22

Craig Hillman will be presenting "Common Mistakes in Electronic Design" as part of focused Design for Reliability session within the annual IPC Midwest Conference. He will also present "Quantitatively Predicting the Reliability of Complex Integrated Circuits" in a technical session. If you would like to schedule a visit to your company while Craig is in the area, please contact June Caswell, jcaswell@dfrsolutions.com.

DfR Solutions at IPC Electronics Midwest: Chicago, Il Sept. 28-30

Randy Schueller will be presenting "Design for Reliability: The Next Generation" at the IPC Midwest Conference on Thursday, September 30th at session S05. For more information or to arrange a meeting during the conference, please contact Randy Schueller, rschueller@dfrsolutions.com .

S05 Design for Reliability (DfR) and Failure Analysis

Thursday, 9/30/2010 8:00 AM - 12:00 PM
Moderator: John Radman, Trace Laboratories East Denver
Turn on the news these days and see how quality recalls can detrimentally affect the confidence and loyalty customers have for a company’s product. This session will cover various failure modes, identify high risk assembly processes, and outline physics of failure (PoF) principles and other critical prevention strategies in DfR that need to be implemented to product a defect-free quality product.

ESD Control for the Automotive Electronics Industry
Gerry Pedone, Delphi Electronics & Safety

Strategies for the Prevention of Board Strain and Cracked Chips in Automotive Electronics
Steve Davidson, Delphi Electronics & Safety

Reliable Solder Identification by X-ray Fluorescence Spectroscopy
Ronald Glaser, CMG Sales/Fischer Technology, Inc.

Design for Reliability: The Next Generation
Randy Schueller, DfR Solutions

Die Attach Solder and Solder Alternatives
Brian Toleno, Ph.D., Henkel Corporation

DfR Solutions at IPC Midwest, Sept. 23-24, 2009

I'll be attending IPC Midwest in Schaumburg, Illinois next week where I'll moderate a panel, present a paper, and be interviewed by iconnect007.

While there,I will present "Pb-Free Reflow, PCB Degradation, and the Influence of Moisture Absorption" in the session:

S03 Challenges in Building a High Reliability Military PWB

Wednesday, 9/23/2009

10:00 AM - 12:00 PM

I'll moderate this session:

S06 Printed Board Reliability Issues

Wednesday, 9/23/2009

1:30 PM - 3:00 PM

Finally, I'll have an interview about the PCB paper with Ray Rasmussen and Steve Gold at the show floor studio at Booth 507 at 11 on Thursday, 9/24/09.

If you'll be at IPC Midwest, please look me up! Otherwise, check back here after the event and I'll have all the material and event recap posted.

For further information, check out these links:

www.ipcmidwestshow.org/html/main/default.htm

www.iconnect007.com/pages/iconnect007.cgi