There was a fantastic turnout at the Austin CTEA Expo & Tech Forum last Thursday, October 22nd! CTEA put together a great program and a great vendor show. The four technical presentations were well-attended, averaging over 60 people per session, and drew many questions, comments, and feedback. The presentations were:
"Manufacturing and Reliability Challenges With QFN" Cheryl Tulkoff, DfR Solutions
"Troubleshooting SMT Yield Problems In a Lead Free World" Ray Prasad, Ray Prasad Consultancy Group
"New and Emerging Technologies in Electronics" Daniel F. Baldwin, Ph.D., Engent, Inc.
"Intellectual Property Law" Kim-Marie Vo, Freescale Semiconductor
To see the presentations made last week, click here.
CTEA (Central Texas Electronics Association) is a combination of the SMTA and IMAPS, organized to foster knowledge sharing and networking across the fields of electronics design, IC assembly, PCB assembly, and related technology arenas in the central Texas region.
Tuesday, October 27, 2009
Wednesday, October 14, 2009
DfR to present at Austin CTEA Expo & Tech Forum Next Week
On Thursday, October 22nd, Cheryl Tulkoff will present,"Manufacturing and Reliability Challenges With QFN" at the Austin CTEA Expo & Tech Forum.
CTEA (SMTA/IMAPS) Austin Expo & Tech Forum
Thursday, October 22, 2009 - Next Thursday!
Norris Conference Center, Austin, TX
Join the Central Texas Electronics Association(CTEA) for their popular annual event, featuring exhibiting companies, networking opportunities, technical presentations including a keynote address given by Dan Baldwin, current SMTA president, free lunch, great doorprizes... and more!
Pre-register online now at: http://www.smta.org/education/vendor_days/vendor_days.cfm#austin
When: Thursday, October 22, 2009
Where: Norris Conference Center, 2525 W Anderson Ln # 365, Austin, TX 78757
Show Hours: 10:30am-5pm
Free Lunch: 12pm
Technical Program:
11:10AM "Manufacturing and Reliability Challenges With QFN"
Cheryl Tulkoff, DfR Solutions
1:20PM "Intellectual Property Law: What Non-Attorneys Should Know"
Kim-Marie Vo, JD, Freescale Semiconductor
2:40PM "Troubleshooting SMT Yield Problems in a Tin-Lead and Lead Free World"
Ray Prasad, Ray Prasad Consultancy Group
3:40PM KEYNOTE PRESENTATION
"New and Emerging Technologies in Electronics"
Dan Baldwin, Ph.D., CEO, Engent, Inc. & current SMTA President
To view an EXHIBITOR LISTING and additional information on the technical program, please visit:
http://www.smta.org/education/vendor_days/vendor_days.cfm#austin
We’ll see you on October 22nd!
CTEA (SMTA/IMAPS) Austin Expo & Tech Forum
Thursday, October 22, 2009 - Next Thursday!
Norris Conference Center, Austin, TX
Join the Central Texas Electronics Association(CTEA) for their popular annual event, featuring exhibiting companies, networking opportunities, technical presentations including a keynote address given by Dan Baldwin, current SMTA president, free lunch, great doorprizes... and more!
Pre-register online now at: http://www.smta.org/education/vendor_days/vendor_days.cfm#austin
When: Thursday, October 22, 2009
Where: Norris Conference Center, 2525 W Anderson Ln # 365, Austin, TX 78757
Show Hours: 10:30am-5pm
Free Lunch: 12pm
Technical Program:
11:10AM "Manufacturing and Reliability Challenges With QFN"
Cheryl Tulkoff, DfR Solutions
1:20PM "Intellectual Property Law: What Non-Attorneys Should Know"
Kim-Marie Vo, JD, Freescale Semiconductor
2:40PM "Troubleshooting SMT Yield Problems in a Tin-Lead and Lead Free World"
Ray Prasad, Ray Prasad Consultancy Group
3:40PM KEYNOTE PRESENTATION
"New and Emerging Technologies in Electronics"
Dan Baldwin, Ph.D., CEO, Engent, Inc. & current SMTA President
To view an EXHIBITOR LISTING and additional information on the technical program, please visit:
http://www.smta.org/education/vendor_days/vendor_days.cfm#austin
We’ll see you on October 22nd!
Wednesday, October 7, 2009
Design for Excellence Course (DfX), Oct 19-22
DfR Solutions, in collaboration with A.T.E. Solutions and IPC, will hold the first ever Design for Excellence (DfX) Course, October 19-22. This collaborative effort will provide tools on how to meet time-to-market deadlines and reduce warranty issues. For more information, please click here.
Tuesday, October 6, 2009
Root-Cause Analysis in the HALT Process - Webinar Now Available!
Dr. Craig Hillman's Webinar presentation "Root-Cause Analysis in the HALT Process" part of the series Ask the Experts hosted by the Qualmark Corporation, is now available on our website! To access the presentation, please click here.
Wednesday, September 30, 2009
IEEE ASTR Workshop October 7-9. Now Available via WEBINAR!
Below is the most up-to-date information for this year’s ASTR Conference on October 7-9 in Jersey City, New Jersey. We have locked in the schedule of speakers and have a great line-up this year, including a panel discussion on the Green/Clean Tech Industry and the role that Accelerated Testing will be playing in this industry.
The big news is now we are offering the conference via webinar as on option. So if you were not able to make it before due to travel restrictions at your company or because you couldn’t get away from the office for a few days, now you can still attend the conference from your desk. And we are offering the conference at half price for this option. Three full days of technical information delivered to your desktop for only $350 (IEEE members) or $375 (non-IEEE members).
CONFERENCE DATES: October 7-9, 2009
Workshop Website
Theme this workshop: RENEWABLE RELIABILITY
Schedule of Events
Over the last few years, Accelerated Stress Testing & Reliability (ASTR) has been embraced by an ever widening array of worldwide companies seeking to reconcile the need for the highest quality product with the necessary push for early time-to-market. The purpose of the ASTR Workshop is to share ideas on better ways of accelerating and detecting hidden defects, flaws, and weaknesses in electronic and electro-mechanical hardware that would result in failures during usage. These techniques are focused on testing electronic hardware to operation and destruction limits and root cause investigation to determine the physics-of-failure. The goal of AST is to produce mature products at market introduction and efficient an effective sampling screens to monitor for manufacturing excursions with high combined stresses (beyond end-use specifications) for shorter lengths of time. The 2009 workshop will focus on ASTR topics in renewable reliability. This theme will be timely, considering emerging world wide investments towards development and commercialization of sustainable and green energy technologies to generate economic growth and environmental security. The workshop will be held at the Hyatt Regency Jersey City on Hudson, overlooking the New York City skyline.
- Cheryl Tulkoff, ASTR 2009 Chair
CONFERENCE INFO
Date: October 7-9, 2009
Location: Jersey City, NJ (Hyatt Regency Jersey City)
Hyatt's Website
Go Directly to the Online Registration Page
The big news is now we are offering the conference via webinar as on option. So if you were not able to make it before due to travel restrictions at your company or because you couldn’t get away from the office for a few days, now you can still attend the conference from your desk. And we are offering the conference at half price for this option. Three full days of technical information delivered to your desktop for only $350 (IEEE members) or $375 (non-IEEE members).
CONFERENCE DATES: October 7-9, 2009
Workshop Website
Theme this workshop: RENEWABLE RELIABILITY
Schedule of Events
Over the last few years, Accelerated Stress Testing & Reliability (ASTR) has been embraced by an ever widening array of worldwide companies seeking to reconcile the need for the highest quality product with the necessary push for early time-to-market. The purpose of the ASTR Workshop is to share ideas on better ways of accelerating and detecting hidden defects, flaws, and weaknesses in electronic and electro-mechanical hardware that would result in failures during usage. These techniques are focused on testing electronic hardware to operation and destruction limits and root cause investigation to determine the physics-of-failure. The goal of AST is to produce mature products at market introduction and efficient an effective sampling screens to monitor for manufacturing excursions with high combined stresses (beyond end-use specifications) for shorter lengths of time. The 2009 workshop will focus on ASTR topics in renewable reliability. This theme will be timely, considering emerging world wide investments towards development and commercialization of sustainable and green energy technologies to generate economic growth and environmental security. The workshop will be held at the Hyatt Regency Jersey City on Hudson, overlooking the New York City skyline.
- Cheryl Tulkoff, ASTR 2009 Chair
CONFERENCE INFO
Date: October 7-9, 2009
Location: Jersey City, NJ (Hyatt Regency Jersey City)
Hyatt's Website
Go Directly to the Online Registration Page
Tuesday, September 29, 2009
Dr. Randy Schueller to present at SMTAI San Diego, Oct. 4-8
Dr. Randy Schueller of DfR Solutions will be very busy out at SMTAI San Diego next week! Randy is giving a class on Reliability of Green Electronics, presenting the two papers, and chairing a session on PCB surface finishes.
Check back after the event for a recap! Some details on the sessions and what he'll be up to:
The Reliability of ‘Green’: Going Beyond SAC305- Sunday, October 4
Randy Schueller, Ph.D., DfR Solutions
What You Will Learn
As the RoHS legislation enters its third year, knowledge of the basics of Pb-free design and manufacturing is proliferating. Consumer electronic OEMs have been manufacturing Pb-free electronics for several years while even companies that produce higher reliability products (telecom, industrial, medical, military, avionics) have made the transition or are in the process of preparing for the eventual demise of SnPb. Unfortunately, the introduction of new environmental legislation and new environmental-friendly materials continues at a rapid pace. As a result, the design / manufacturing / component / reliability engineer continues to struggle with new Pb-free alloys and halogen-free materials, among other issues. While this course will provide a comprehensive overview of some of the challenges of Pb-free, it will also focus on some of the newest issues in ‘green’ electronics. These will include tin whisker mitigations, halogen-free laminate, manufacturing challenges that continue to be a problem with Pb-free, the performance of second (2nd) generation Pb-free solders, and the newest long-term reliability information for Pb-free.
Who Should Attend
This course is geared toward engineers and managers in the areas of product development, manufacturing, quality, or reliability. Nearly all companies are migrating toward green products whether or not it is intentional. As non-green materials in the electronics industry are phased out, it is critical to understand the key differences and reliability issues that can result from the new material and processes. Consequently, anyone involved in the early life cycle of a product who wishes to mitigate the risk of failure would find value in attending this course.
Topics Covered
The advent of lead-free soldering with the de-facto SAC305 standard and its close relatives has resulted in poor performance and increased cost in some applications. It is only natural that research for substitute materials would transpire. This session will cover some of the work in this arena, most notably Investigations on the processability of SnCuNi alloy for SMT assembly, efforts to minimize and standardize the number of lead-free alloys used, and experimental data and its interpretation for some "second generation" lead-free alloys. The papers will present process development, reliability data, and explanation of the results. This session is ideal for the person who wants to be brought up to speed on what is happening in alternative lead-free alloys to improve performance and reduce cost.
Second Generation Lead-Free Alloys
Randy Schueller
, Ph. D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D., DfR Solutions
Options for Controlling Moisture Sensitivity in Packages and PWBs During Assembly- Tuesday, October 6
Pb-Free Reflow, PCB Degradation, and the Influence of Moisture Absorption
Randy Schueller, DfR Solutions
New Technical Advancements in PCB Surface Finishes - Wednesday, October 7
Chair: Randy Schueller, Ph.D., DfR Solutions
The surface finish one selects for the PCB is oftentimes the most critical decision in enabling a successful assembly process, and ultimately a reliable end product. The fact that there are half a dozen widely used surface finishes currently on the market suggests there is no single one that meets the many needs of the industry and thus sacrifices are being made. Much research and development is taking place to significantly improve existing surface finishes and in some cases invent new finishes with attributes suitable for a wider range of products. This session contains three excellent papers; the first addresses the important issue of controlling creep corrosion failure on immersion silver PCBs. The new use of organic metals to greatly improve the characteristics of immersion tin finishes is presented in the second paper. The final paper is the revealing of a promising new surface finish material with many attractive properties for the electronics industry. Anyone involved in design, assembly, or reliability would benefit from this session.
Check back after the event for a recap! Some details on the sessions and what he'll be up to:
The Reliability of ‘Green’: Going Beyond SAC305- Sunday, October 4
Randy Schueller, Ph.D., DfR Solutions
What You Will Learn
As the RoHS legislation enters its third year, knowledge of the basics of Pb-free design and manufacturing is proliferating. Consumer electronic OEMs have been manufacturing Pb-free electronics for several years while even companies that produce higher reliability products (telecom, industrial, medical, military, avionics) have made the transition or are in the process of preparing for the eventual demise of SnPb. Unfortunately, the introduction of new environmental legislation and new environmental-friendly materials continues at a rapid pace. As a result, the design / manufacturing / component / reliability engineer continues to struggle with new Pb-free alloys and halogen-free materials, among other issues. While this course will provide a comprehensive overview of some of the challenges of Pb-free, it will also focus on some of the newest issues in ‘green’ electronics. These will include tin whisker mitigations, halogen-free laminate, manufacturing challenges that continue to be a problem with Pb-free, the performance of second (2nd) generation Pb-free solders, and the newest long-term reliability information for Pb-free.
Who Should Attend
This course is geared toward engineers and managers in the areas of product development, manufacturing, quality, or reliability. Nearly all companies are migrating toward green products whether or not it is intentional. As non-green materials in the electronics industry are phased out, it is critical to understand the key differences and reliability issues that can result from the new material and processes. Consequently, anyone involved in the early life cycle of a product who wishes to mitigate the risk of failure would find value in attending this course.
Topics Covered
- Components
- Understanding process sensitivity levels (PSL)
- Tin Whisker: predictions and mitigations
- Printed Circuit Boards
- Predicting and preventing printed board damage
- Newest Pb-free solderability finishes
- Halogen-free laminates: the good, the bad, and the ugly
- Solder and Manufacturing
- 2nd generation solders: what/who/why
- Finding a solution to hole fill
- Is Pb-free the culprit to head-in-pillow?
- Long-Term Reliability
- Temperature cycling
- Mechanical shock
- Vibration
The advent of lead-free soldering with the de-facto SAC305 standard and its close relatives has resulted in poor performance and increased cost in some applications. It is only natural that research for substitute materials would transpire. This session will cover some of the work in this arena, most notably Investigations on the processability of SnCuNi alloy for SMT assembly, efforts to minimize and standardize the number of lead-free alloys used, and experimental data and its interpretation for some "second generation" lead-free alloys. The papers will present process development, reliability data, and explanation of the results. This session is ideal for the person who wants to be brought up to speed on what is happening in alternative lead-free alloys to improve performance and reduce cost.
Randy Schueller
, Ph. D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D., DfR Solutions Options for Controlling Moisture Sensitivity in Packages and PWBs During Assembly- Tuesday, October 6
Randy Schueller
, DfR Solutions New Technical Advancements in PCB Surface Finishes - Wednesday, October 7
Chair: Randy Schueller, Ph.D., DfR Solutions
The surface finish one selects for the PCB is oftentimes the most critical decision in enabling a successful assembly process, and ultimately a reliable end product. The fact that there are half a dozen widely used surface finishes currently on the market suggests there is no single one that meets the many needs of the industry and thus sacrifices are being made. Much research and development is taking place to significantly improve existing surface finishes and in some cases invent new finishes with attributes suitable for a wider range of products. This session contains three excellent papers; the first addresses the important issue of controlling creep corrosion failure on immersion silver PCBs. The new use of organic metals to greatly improve the characteristics of immersion tin finishes is presented in the second paper. The final paper is the revealing of a promising new surface finish material with many attractive properties for the electronics industry. Anyone involved in design, assembly, or reliability would benefit from this session.
Monday, September 28, 2009
Dr. Nathan Blattau to present Oct 8th at the IEEE ASTR Workshop in Jersey City, NJ
On Thursday, October 8th, Dr. Nathan Blattau will present, "Thermo-mechanical Fatigue Testing of Printed Circuit Card Assemblies Using Power Cycling" at the annual IEEE ASTR (Accelerated Stress Testing and Reliability) Workshop in Jersey City, NJ.
Check back after the event for a recap and link to his material and presentation!
About the ASTR Workshop
Over the last few years, Accelerated Stress Testing & Reliability (ASTR) has been embraced by an ever widening array of worldwide companies seeking to reconcile the need for the highest quality product with the necessary push for early time-to-market. The purpose of the ASTR Workshop is to share ideas on better ways of accelerating and detecting hidden defects, flaws, and weaknesses in electronic and electro-mechanical hardware that would result in failures during usage. These techniques are focused on testing electronic hardware to operation and and destruction limits and root cause investigation to determine the physics-of-failure. The goal of AST is to produce mature products at market introduction and efficient an effective sampling screens to monitor for manufacturing excursions with high combined stresses (beyond end-use specifications) for shorter lengths of time. The 2009 workshop will focus on ASTR topics in renewable reliability. This theme will be timely, considering emerging world wide investments towards development and commercialization of sustainable and green energy technologies to generate economic growth and environmental security. The workshop will be held at the Hyatt Regency Jersey City on Hudson, overlooking the New York City skyline.
Check back after the event for a recap and link to his material and presentation!
About the ASTR Workshop
Over the last few years, Accelerated Stress Testing & Reliability (ASTR) has been embraced by an ever widening array of worldwide companies seeking to reconcile the need for the highest quality product with the necessary push for early time-to-market. The purpose of the ASTR Workshop is to share ideas on better ways of accelerating and detecting hidden defects, flaws, and weaknesses in electronic and electro-mechanical hardware that would result in failures during usage. These techniques are focused on testing electronic hardware to operation and and destruction limits and root cause investigation to determine the physics-of-failure. The goal of AST is to produce mature products at market introduction and efficient an effective sampling screens to monitor for manufacturing excursions with high combined stresses (beyond end-use specifications) for shorter lengths of time. The 2009 workshop will focus on ASTR topics in renewable reliability. This theme will be timely, considering emerging world wide investments towards development and commercialization of sustainable and green energy technologies to generate economic growth and environmental security. The workshop will be held at the Hyatt Regency Jersey City on Hudson, overlooking the New York City skyline.
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