Upcoming Publication in Chip Scale Review

Nathan Blattau and Craig Hillman will have an article entitled "Designing and Qualifying Chip Scale Packages" published in the upcoming issue of Chip Scale Review. The race to keep up with Moore's Law through packaging has resulted in an expansion of the very concept of a chip scale package. This includes the recent introduction of silicon interposers, through silicon vias, and embedded die designs. Be on the lookout for this informative article.