It's not too late to Learn About Pad Cratering Detection and Prevention! Join Us At SMTA International in Orlando.

Join Us At SMTA International in Orlando:
Monday, October 15, 2012, 8:30am to 12pm EDT 

Pad Cratering: Prevention, Mitigation, and Detection Strategies 

Pad cratering is defined as cracking which initiates within the laminate during a dynamic mechanical event such as In Circuit Testing (ICT), board depanelization, connector insertion, and other shock and vibration inducing activities. 

In this course, you'll learn the key drivers, measurement and detection protocols, and preventive tactics for this serious but prevalent failure. Pad cratering was first recognized in BGA packages but newer leadless, bottom termination components are also vulnerable.  

Don't miss out! Register here.